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EP910JC-35

Texas Instruments

EP910JC-35 by Texas Instruments

EP910JC-35 by Texas Instruments is a UV PLD with 240 product terms, 38 ns propagation delay, and 31.3 MHz max clock frequency. Ideal for PAL-type applications requiring 12 dedicated inputs and 24 I/O lines in commercial temperature range. Package style is chip carrier with ceramic-metal body material.

Median Price

$21.370

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 111 parts In-Stock

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$21.370

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Vyrian

USA . 5,352 parts In-Stock

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Digiode

USA . 2,410 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

UK . 31 parts In-Stock

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ComSIT Distribution GmbH

Germany . 29 parts In-Stock

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J & M Industries LLC

USA . 13 parts In-Stock

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Q Components

USA . 13 parts In-Stock

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Standard Data Resources

USA . 5 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 2 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 1 parts In-Stock

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Native Components

USA . 564 parts In-Stock

1+ parts

$0.065

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$0.063

564

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$0.063

Northwest PG Solutions

USA . 2,294 parts In-Stock

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$0.072

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$0.063

2,294

$0.072

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$0.063

AZTECH Wire

Italy . 842 parts In-Stock

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$5.833

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$5.833

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Andel Nordic

Denmark . 1,329 parts In-Stock

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$15.830

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$11.084

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$11.084

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$15.830

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$11.084

Semicontronic

India . 461 parts In-Stock

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$21.000

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$20.475

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$20.370

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461

$21.000

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Corohmni

South Africa . 298 parts In-Stock

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$21.370

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One Stop Electronics

USA . 897 parts In-Stock

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$34.000

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$34.000

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MARBEL Systems

Belgium . 49 parts In-Stock

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$71.694

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$68.826

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Parana Technologies

USA . 1,614 parts In-Stock

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$75.194

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Texas Native Microelectronics

USA . 2,810 parts In-Stock

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$82.407

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$79.111

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$76.639

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DigiPath Technology Company

USA . 1,352 parts In-Stock

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$82.798

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$76.174

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ChromeModa Solutions

Germany . 6,793 parts In-Stock

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$84.488

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$69.280

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IDEA Electronic Components Group

UK . 57 parts In-Stock

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$84.488

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$80.264

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$76.039

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Kenton Components

USA . 75 parts In-Stock

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$98.888

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$87.022

75

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$87.022

Modulus Dynamics

Lithuania . 277 parts In-Stock

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$125.741

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$125.741

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$125.741

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Alle Elektronik GmbH

Germany . 4,163 parts In-Stock

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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Corphita

USA . 1,386 parts In-Stock

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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Lixinc

USA . 393 parts In-Stock

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Supply Digital

USA . 204 parts In-Stock

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Qasali Group International

UK . 120 parts In-Stock

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$213.599

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$195.799

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$195.799

GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Discover the EP910JC-35 by Texas Instruments, a high-quality Programmable Logic Device designed to meet your unique application needs. With its advanced technology and durable ceramic, metal-sealed co-fired package, this UV PLD offers fast propagation delay and versatile functionality. Whether you need to optimize system performance or enhance product designs, this PAL-type architecture with 240 product terms and 24 I/O lines delivers exceptional value and reliability. Elevate your projects with the EP910JC-35 and experience the benefits of Texas Instruments' trusted manufacturing expertise.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures high durability and reliability in various environmental conditions.

Propagation Delay: 38 ns

Low propagation delay of 38 ns ensures fast response time and efficient operation of the programmable logic device.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

Provides a high maximum supply voltage of 5.25 V, allowing for flexibility in power requirements and compatibility with various systems.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the overall performance of the device.

No. of Inputs: 36

Having 36 inputs provides ample connectivity options and versatility in designing complex logic functions.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and compatibility with standard mounting configurations.

Form Of Terminal: J BEND

J Bend terminal design simplifies the soldering process and ensures secure connections for reliable operation.

Architecture: PAL-TYPE

PAL-type architecture offers programmable AND/OR array, providing flexibility in implementing various logic functions and custom designs.

Nominal Supply Voltage (V): 5

Stable nominal supply voltage of 5 V ensures consistent performance and compatibility with standard power sources.

Technical Specifications

Programmable Logic Devices (PLD) EP910JC-35 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

12 Dedicated Inputs, 24 I/O

No. of Outputs:

24

Output Function:

Macrocell

No. of Inputs:

36

No. of Product Terms:

240

No. of Dedicated Inputs:

12

No. of I/O Lines:

24

Maximum Clock Frequency:

31.3 MHz

Propagation Delay:

38 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

24 Macrocell; Configurable I/O

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC44,.7SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

44

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-J44

Qualified:

No

Trade Compliance

EP910JC-35 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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