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EP910LC-40

Texas Instruments

EP910LC-40 by Texas Instruments

EP910LC-40 by Texas Instruments is a CMOS PAL-type PLD with 36 inputs, 24 I/O lines, and 240 product terms. It operates at a max clock frequency of 29.4 MHz and has a propagation delay of 43 ns. Suitable for commercial applications requiring programmable logic devices with macrocell output function in plastic/epoxy package style.

Median Price

$90.630

Lifecycle Status

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Rochester

USA . 10 parts In-Stock

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$90.630

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$85.190

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$79.750

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Farnell

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Forefront Electronics and Design

USA . 5 parts In-Stock

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$31.850

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Digiode

USA . 3,972 parts In-Stock

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Vyrian

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DigiKey Marketplace

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MRC Electronics

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Digital Electronic Gebert Verwaltungs UG

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PC Components Company LLC

USA . 120 parts In-Stock

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First Choice Components Inc.

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Sinequanon

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ComSIT Distribution GmbH

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Q Components

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Semi Source

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Cyclops Electronics Ltd

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Inland Empire Components Inc.

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Northwest PG Solutions

USA . 3,596 parts In-Stock

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$0.693

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$0.693

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Native Components

USA . 259 parts In-Stock

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$1.505

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$1.505

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Parana Technologies

USA . 910 parts In-Stock

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$18.176

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$1,687.961

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$16.359

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910

$18.176

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$16.359

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DigiPath Technology Company

USA . 985 parts In-Stock

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$20.015

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ChromeModa Solutions

Germany . 1,458 parts In-Stock

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$20.423

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$16.747

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IDEA Electronic Components Group

UK . 1,128 parts In-Stock

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$20.423

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$19.402

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$18.381

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Corohmni

South Africa . 298 parts In-Stock

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$31.850

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Modulus Dynamics

Lithuania . 601 parts In-Stock

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$49.767

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Semicontronic

India . 105 parts In-Stock

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$81.520

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$79.482

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$79.074

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One Stop Electronics

USA . 84 parts In-Stock

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$81.520

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Corphita

USA . 2,354 parts In-Stock

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$86.310

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Vigor

Singapore . 829 parts In-Stock

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$92.060

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Texas Native Microelectronics

USA . 562 parts In-Stock

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$183.683

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$161.641

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Kenton Components

USA . 970 parts In-Stock

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$220.420

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$211.603

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$204.990

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$193.969

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$193.969

Qasali Group International

UK . 51 parts In-Stock

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$495.944

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$461.228

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MARBEL Systems

Belgium . 6,150 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,502 parts In-Stock

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Glotronic Ltd.

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Supply Digital

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Microchip USA

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A-Z Elektronik GmbH

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Perfect Parts

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Kepictronics

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Assy Fe

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Overview

Unlock limitless possibilities with the EP910LC-40 by Texas Instruments, a high-quality Programmable Logic Device that offers unmatched value and performance. Manufactured by the renowned Texas Instruments, this PLD boasts a robust architecture, fast propagation delay, and versatile applications in various industries. With 36 inputs, 24 I/O lines, and a maximum clock frequency of 29.4 MHz, this chip carrier package delivers exceptional functionality and reliability for your projects. Experience the benefits of cutting-edge technology and precision engineering with the EP910LC-40, setting new standards for excellence in programmable ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the PLD, ensuring a long lifespan.

Propagation Delay: 43 ns

Fast propagation delay of 43 ns allows for quick response times in processing inputs and generating outputs, making the PLD efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability makes it easier to integrate the PLD into various electronic circuits and PCB designs, simplifying the assembly process.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage of 5.25 V provides flexibility in power requirements and ensures stable operation under varying voltage conditions.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the PLD energy-efficient and reliable in diverse applications.

No. of Inputs: 36

36 inputs allow for a wide range of input signals to be processed simultaneously, enhancing the versatility and capability of the PLD.

Package Shape: SQUARE

Square package shape enables easy placement and alignment within electronic circuits, optimizing space utilization and ensuring compatibility with standard mounting options.

Form Of Terminal: J BEND

J Bend terminals facilitate secure connection and soldering onto PCBs, providing reliable electrical contact and mechanical stability for the PLD.

Architecture: PAL-TYPE

PAL-type architecture offers versatile programmability and configurable logic functions, allowing the PLD to be customized for specific logic applications and design requirements.

Nominal Supply Voltage (V): 5

Nominal supply voltage of 5 V ensures compatibility with standard power sources and supports reliable operation within specified voltage limits.

Power Supplies (V): 5

Dual power supplies of 5 V provide stable voltage regulation for internal logic and I/O interfaces, ensuring consistent performance under varying load conditions.

No. of Terminals: 44

44 terminals offer ample connectivity options for input, output, power, and ground connections, facilitating easy integration and customization of the PLD in electronic systems.

Programmable IC Type: OT PLD

OT PLD type allows for on-the-fly programming and reconfiguration of logic functions, enabling dynamic changes to the PLD's behavior without the need for physical modifications or replacements.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides a compact and lightweight form factor, ideal for space-constrained applications and portable electronic devices requiring high-density integration.

Output Function: MACROCELL

Macrocell output function offers configurable logic output capabilities with advanced features such as registered outputs, asynchronous resets, and feedback paths, enhancing the versatility and performance of the PLD.

No. of Product Terms: 240

240 product terms enable complex logic functions and intricate Boolean expressions to be implemented within the PLD, allowing for sophisticated logic processing and signal manipulation.

Minimum Supply Voltage: 4.75 V

Minimum supply voltage of 4.75 V ensures reliable operation at lower voltage levels without compromising performance, making the PLD suitable for energy-efficient and battery-powered applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures reliable performance in harsh environmental conditions and thermal stress, providing durability and stability to the PLD under heat exposure.

Pitch Of Terminal: 1.27 mm

1.27 mm terminal pitch allows for easy soldering and mounting onto standard PCB pads, ensuring proper alignment and connection without the risk of short circuits or misalignments.

Organization: 12 DEDICATED INPUTS, 24 I/O

Organization of 12 dedicated inputs and 24 I/O lines provides a balanced mix of dedicated and configurable input/output options, offering flexibility and versatility in logic interfacing and data communication.

No. of Dedicated Inputs: 12

12 dedicated inputs offer specialized signal processing and logic gating capabilities for critical input signals, enabling precise control and data manipulation within the PLD.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures reliable performance in cold environments and thermal stability, making the PLD suitable for extended operating conditions and temperature ranges.

Position Of Terminal: QUAD

Quad terminal configuration provides multiple connection points for power, ground, and signal terminals, enhancing electrical contact reliability and signal integrity in the PLD's interfacing.

Maximum Clock Frequency: 29.4 MHz

High maximum clock frequency of 29.4 MHz allows for fast clocked operations and synchronous logic processing, enabling high-speed data handling and real-time signal manipulation within the PLD.

No. of Outputs: 24

24 outputs provide ample output channels for logic signaling, data transmission, and feedback signals, offering comprehensive output options and flexibility in wiring configurations for diverse applications.

No. of I/O Lines: 24

24 I/O lines offer a balanced mix of input and output interfaces, enabling bidirectional data communication, signal processing, and control logic operations within the PLD.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures reliable performance in standard operating conditions and environments, making the PLD suitable for commercial and industrial applications with moderate thermal requirements.

Technical Specifications

Programmable Logic Devices (PLD) EP910LC-40 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

12 Dedicated Inputs, 24 I/O

No. of Outputs:

24

Output Function:

Macrocell

No. of Inputs:

36

No. of Product Terms:

240

No. of Dedicated Inputs:

12

No. of I/O Lines:

24

Maximum Clock Frequency:

29.4 MHz

Propagation Delay:

43 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

24 Macrocell; Configurable I/O

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC44,.7SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

44

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J44

Qualified:

No

Trade Compliance

EP910LC-40 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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