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DS89C21TM

Texas Instruments

DS89C21TM by Texas Instruments

DS89C21TM by Texas Instruments is a CMOS Line Transceiver with 8 terminals. It operates at 5V, has a max supply voltage of 5.5V, and supports differential output. With a small outline package style, it is ideal for industrial applications requiring V.11, EIA-422-A, or TIA-422-A interface standards.

Median Price

$2.690

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 65 parts In-Stock

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$2.690

100+ parts

$2.020

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$1.750

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65

$2.690

$2.020

$1.750

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Digiode

USA . 3,277 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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ComSIT Distribution GmbH

Germany . 752 parts In-Stock

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Vyrian

USA . 504 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 184 parts In-Stock

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Anansix

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Kronex Distribution GmbH

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Prism Electronics

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Bristol Electronics

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Atlantic Semiconductor

USA . 81 parts In-Stock

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Beltway Electronics Company

USA . 76 parts In-Stock

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North Shore Components

USA . 70 parts In-Stock

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Resion

USA . 45 parts In-Stock

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Semtec, LLC

USA . 28 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 28 parts In-Stock

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Pegasus Components GmbH

Germany . 13 parts In-Stock

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Inland Empire Components Inc.

USA . 8 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 801 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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801

$0.500

$0.488

$0.485

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Parana Technologies

USA . 1,860 parts In-Stock

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$5.317

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$5.960

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1,860

$5.317

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$5.960

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DigiPath Technology Company

USA . 2,183 parts In-Stock

1+ parts

$5.855

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$5.386

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2,183

$5.855

$5.386

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

1+ parts

$5.974

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$5.377

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1,184

$5.974

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$5.377

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ChromeModa Solutions

Germany . 1,009 parts In-Stock

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$5.974

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$4.899

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$5.974

$4.899

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AZTECH Wire

Italy . 796 parts In-Stock

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$10.550

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One Stop Electronics

USA . 1,605 parts In-Stock

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$36.500

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$36.500

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Ampacity Inc.

Singapore . 1,613 parts In-Stock

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$50.500

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$50.500

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Component Stockers USA

USA . 286 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,534 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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Continental Prestige Electronics

USA . 4,913 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,955 parts In-Stock

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Corphita

USA . 3,793 parts In-Stock

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Argo Parts USA

USA . 2,211 parts In-Stock

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Perfect Parts

USA . 2,079 parts In-Stock

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Microchip USA

USA . 2,019 parts In-Stock

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Kepictronics

USA . 1,200 parts In-Stock

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Assy Fe

Spain . 1,101 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Authorized Procurement Solutions

USA . 83 parts In-Stock

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Overview

Elevate your system's performance with the DS89C21TM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their line drivers & receivers. This versatile product is perfect for a range of applications, offering high-speed transmission with minimal delay, ensuring seamless communication. With a compact design and industrial-grade temperature range, the DS89C21TM provides exceptional value and efficiency. Upgrade your technology with Texas Instruments and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

Support for a high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into electronic devices and circuit layouts.

Maximum Transmit Delay: 10 ns

Low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage ensures compatibility with many existing systems and power sources.

No. of Terminals: 8

Having 8 terminals provides flexibility for connecting to other components and devices in a circuit.

Temperature Grade: INDUSTRIAL

Industrial temperature grade allows the product to operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Line Drivers & Receivers DS89C21TM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

V.11; EIA-422-A; TIA-422-A

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Maximum Output Low Current:

6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Maximum Transmit Delay:

10 ns

Width:

3.9 mm

Trade Compliance

DS89C21TM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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