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DS8923AMX

Texas Instruments

DS8923AMX by Texas Instruments

DS8923AMX by Texas Instruments is a line driver and receiver with 2 functions. It has a max transmit delay of 15 ns and a max receive delay of 20 ns. This IC is commonly used in EIA-422, ESDI, ST412, and ST506 interfaces.

Median Price

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Lifecycle Status

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15

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Digiode

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Mentor Electronics Marketing, LLC

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Holdelec - ElecDif-Pro

France . 2,400 parts In-Stock

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Bristol Electronics

USA . 1,775 parts In-Stock

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PC Components Company LLC

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Microfarads

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Semi Source

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Chip Stock

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Vyrian

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Zilex Electronics Inc.

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Anansix

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Vectronix, Inc

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ACDS - Activité Composants Distribution Service

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Nova Conductors

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ComSIT Distribution GmbH

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Parana Technologies

USA . 727 parts In-Stock

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$2.948

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$3.447

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$2.948

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DigiPath Technology Company

USA . 1,554 parts In-Stock

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$3.246

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$2.986

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Corohmni

South Africa . 853 parts In-Stock

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$3.282

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ChromeModa Solutions

Germany . 4,472 parts In-Stock

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$2.716

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IDEA Electronic Components Group

UK . 959 parts In-Stock

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$3.312

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$2.981

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Ampacity Inc.

Singapore . 1,001 parts In-Stock

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$3.500

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One Stop Electronics

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$18.500

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AZTECH Wire

Italy . 715 parts In-Stock

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Semicontronic

India . 1,377 parts In-Stock

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$28.500

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$27.788

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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A-Z Elektronik GmbH

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Microchip USA

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Alle Elektronik GmbH

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Perfect Parts

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Continental Prestige Electronics

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Metaverse IC Inc.

Canada . 2,500 parts In-Stock

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Argo Parts USA

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ChipTracer

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Cyclops Electronics Ltd (Excess)

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Bastille Electronics

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Overview

Discover the DS8923AMX by Texas Instruments, a high-quality line driver and receiver that offers exceptional value and benefits to customers. With its advanced technology and reliable performance, this product ensures seamless communication in various applications. Whether you need to transmit data quickly or receive signals accurately, the DS8923AMX has got you covered. Its compact design and surface mount feature make it easy to integrate into any system. Trust Texas Instruments, a renowned manufacturer known for their innovative solutions, and experience the advantages of the DS8923AMX firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components, making this product suitable for various working environments.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

This product offers two functions in one, providing cost-effectiveness and reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement and organization within electronic systems.

Maximum Transmit Delay: 15 ns

With a low maximum transmit delay, this line driver and receiver ensures fast and efficient signal transmission, making it ideal for time-sensitive applications.

No. of Terminals: 16

The high number of terminals provides flexibility and compatibility for connecting with various devices and systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact designs and space-saving solutions.

Maximum Operating Temperature: 70 °C

The product's capability to withstand high operating temperatures ensures reliable performance under demanding conditions.

Minimum Operating Temperature: 0 °C

This line driver and receiver can operate efficiently in low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers excellent solderability, enhancing the durability and reliability of the product.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and ensures secure connections.

Maximum Seated Height: 1.75 mm

The low maximum seated height enables the product to be used in compact spaces and thin-profile applications.

Width: 3.9 mm

The compact width of the product allows for efficient use of board space and simplifies integration into electronic systems.

Receiver No. of Bits: 2

The two bits receiver configuration enables the product to handle various data formats and enhances compatibility for data transmissions.

Differential Output: YES

The differential output feature helps to eliminate common-mode noise and ensures high-quality signals, making this product suitable for noisy environments.

Maximum Time At Peak Reflow Temperature (s): 20

The product's ability to withstand high reflow temperatures for up to 20 seconds ensures proper soldering during assembly.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235°C, this line driver and receiver can withstand high-temperature soldering processes, providing robust solder joints.

Length: 9.9 mm

The compact length of the product allows for easy integration into space-constrained applications and circuit board layouts.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets the temperature requirements for standard operating environments.

Maximum Receive Delay: 20 ns

The low maximum receive delay ensures quick response time for received signals, making this product suitable for real-time data transmission.

Technology: BIPOLAR

The use of bipolar technology enhances the product's performance, offering improved noise immunity and signal integrity.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process, ensuring secure and reliable connections.

Interface Standard: EIA-422; ESDI; ST412; ST506

This line driver and receiver are compatible with multiple interface standards, providing versatility for different communication protocols.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics improve noise immunity and provide hysteresis, ensuring reliable signal detection and processing.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for precise and compact connections, facilitating high-density circuit designs.

Driver No. of Bits: 2

With a two-bit driver configuration, this product can handle various data formats and ensure accurate and reliable data transmission.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 indicates that this product has a low risk of moisture-related damage, ensuring its reliability during storage and assembly.

Interface IC Type: LINE TRANSCEIVER

This product is an interface IC type line transceiver, offering versatile communication capabilities and making it suitable for a wide range of applications.

Technical Specifications

Line Drivers & Receivers DS8923AMX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

2 RECEIVERS ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVERS

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; ESDI; ST412; ST506

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Maximum Transmit Delay:

15 ns

Width:

3.9 mm

Trade Compliance

DS8923AMX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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