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DS250DF230RTVT

Texas Instruments

DS250DF230RTVT by Texas Instruments

DS250DF230RTVT by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -40 to 85 °C. It features differential input/output, open-drain output polarity, and nickel palladium gold terminal finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$21.580

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 835 parts In-Stock

1+ parts

$21.580

100+ parts

$18.850

1k+ parts

$13.000

10k+ parts

-

835

$21.580

$18.850

$13.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,625 parts In-Stock

1+ parts

$20.501

100+ parts

-

1k+ parts

-

10k+ parts

-

1,625

$20.501

-

-

-

Vyrian

USA . 4,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,613

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,223 parts In-Stock

1+ parts

$6.265

100+ parts

-

1k+ parts

$7.020

10k+ parts

-

1,223

$6.265

-

$7.020

-

DigiPath Technology Company

USA . 435 parts In-Stock

1+ parts

$6.898

100+ parts

$6.346

1k+ parts

-

10k+ parts

-

435

$6.898

$6.346

-

-

ChromeModa Solutions

Germany . 5,341 parts In-Stock

1+ parts

$7.039

100+ parts

$5.772

1k+ parts

-

10k+ parts

-

5,341

$7.039

$5.772

-

-

IDEA Electronic Components Group

UK . 420 parts In-Stock

1+ parts

$7.039

100+ parts

-

1k+ parts

$6.335

10k+ parts

-

420

$7.039

-

$6.335

-

AZTECH Wire

Italy . 700 parts In-Stock

1+ parts

$15.800

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$15.800

-

-

-

Corphita

USA . 3,966 parts In-Stock

1+ parts

$19.422

100+ parts

-

1k+ parts

-

10k+ parts

-

3,966

$19.422

-

-

-

Microchip USA

USA . 2,073 parts In-Stock

1+ parts

$53.310

100+ parts

$52.550

1k+ parts

$52.170

10k+ parts

$51.780

2,073

$53.310

$52.550

$52.170

$51.780

Northwest PG Solutions

USA . 516 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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516

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-

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Native Components

USA . 398 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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398

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Overview

Unlock the power of high-quality communication with the Texas Instruments DS250DF230RTVT line driver & receiver. Designed by a trusted manufacturer, this versatile chip carrier offers unparalleled reliability and efficiency. Ideal for industrial applications, this product boasts a wide temperature range and differential output capabilities. Experience seamless data transmission with the complementary output polarity and no-lead terminal form. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.625 V

Optimal voltage tolerance for stable and efficient performance.

No. of Functions: 2

Multiple functions are provided in a single package, reducing the need for additional components.

Package Shape: SQUARE

Compact shape that allows for efficient use of space on the circuit board.

No. of Terminals: 32

Sufficient terminals for connecting the product to other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Effective heat dissipation for improved overall performance and reliability.

Minimum Supply Voltage: 2.375 V

Supports a wide range of supply voltages for flexibility in different applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, suitable for industrial use.

Output Characteristics: OPEN-DRAIN

Provides an open-drain output, which is ideal for applications requiring a low output impedance.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme temperature conditions, ensuring reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for excellent connectivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position for easy and secure connections in the circuit.

Maximum Seated Height: 0.8 mm

Low profile design for space-saving and compact integration in the system.

Width: 5 mm

Compact width for efficient placement on the PCB.

Output Polarity: COMPLEMENTARY

Complementary output polarity for efficient signal transmission and noise immunity.

Receiver No. of Bits: 2

Supports 2 bits for accurate data reception and processing.

Differential Output: YES

Differential output for noise reduction and improved signal quality.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during assembly.

Length: 5 mm

Compact length for space-efficient design and integration.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for reliable operation in harsh conditions.

No. of Channels: 2

Dual channels for simultaneous data transmission and reception.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS-compliant applications.

Input Characteristics: DIFFERENTIAL

Differential input for noise immunity and high signal integrity.

Nominal Supply Voltage: 2.5 V

Stable and reliable supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and compact layout.

Driver No. of Bits: 2

2 bits for accurate data transmission and control.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type for seamless communication between devices.

Technical Specifications

Line Drivers & Receivers DS250DF230RTVT attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

2

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

DS250DF230RTVT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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