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DS15EA101SQ

Texas Instruments

DS15EA101SQ by Texas Instruments

DS15EA101SQ by Texas Instruments is a 16-terminal analog data transmission interface with a package style of chip carrier. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications as a line equalizer with a nominal voltage of 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,194 parts In-Stock

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Digiode

USA . 1,762 parts In-Stock

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Anansix

USA . 1,309 parts In-Stock

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Dark Horse Electronics

USA . 50 parts In-Stock

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50

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 233 parts In-Stock

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$8.135

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233

$8.135

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Parana Technologies

USA . 684 parts In-Stock

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$13.344

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$13.857

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684

$13.344

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DigiPath Technology Company

USA . 1,538 parts In-Stock

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$14.693

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$13.518

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1,538

$14.693

$13.518

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ChromeModa Solutions

Germany . 5,676 parts In-Stock

1+ parts

$14.993

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$12.294

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$14.993

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

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$14.993

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$14.243

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$13.494

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$14.993

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Native Components

USA . 358 parts In-Stock

1+ parts

$323.620

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$317.148

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$313.911

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$310.675

358

$323.620

$317.148

$313.911

$310.675

Northwest PG Solutions

USA . 673 parts In-Stock

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$355.982

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One Stop Electronics

USA . 1,004 parts In-Stock

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$629.000

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Corphita

USA . 1,275 parts In-Stock

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Overview

Elevate your data transmission experience with the DS15EA101SQ by Texas Instruments, a cutting-edge analog interface that delivers unparalleled quality and reliability. Crafted by a trusted manufacturer known for its innovative solutions, this product is designed to excel in various applications. With a compact square package shape and 16 terminals, this line equalizer offers exceptional value to customers seeking high-performance telecom ICs. Experience the benefits of seamless communication and enhanced efficiency with the DS15EA101SQ - the perfect choice for industrial-grade operations. Elevate your data transmission experience with Texas Instruments today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for automated manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it ideal for applications where space is limited.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and interfaces, increasing the versatility of this product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles helps in efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and a reliable electrical connection.

Terminal Position: QUAD

The quad terminal position allows for easy and secure mounting on the PCB, enhancing overall product stability.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm contributes to a low-profile design, suitable for compact electronic devices.

Width: 4 mm

The 4 mm width is ideal for applications requiring a slim and space-efficient form factor.

Length: 4 mm

The 4 mm length complements the square package shape, further optimizing the product's footprint.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand demanding temperature variations and rugged environments.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of potential lead-related hazards, making this product environmentally friendly.

Telecom IC Type: LINE EQUALIZER

Featuring a line equalizer telecom IC type, this product helps in signal optimization and quality enhancement in communication systems.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is compatible with common power sources, ensuring ease of integration into various electronic systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch facilitates precise and compact PCB layout, enhancing overall system efficiency.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product is suitable for applications where exposure to moisture is a concern, ensuring long-term reliability.

Technical Specifications

Analog Data Transmission Interfaces DS15EA101SQ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

DS15EA101SQ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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