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DS15EA101SQ/NOPB

Texas Instruments

DS15EA101SQ/NOPB by Texas Instruments

DS15EA101SQ/NOPB by Texas Instruments is a 16-terminal analog data transmission interface with 3.3V supply voltage. It features a square package shape, matte tin terminal finish, and operates in industrial temperature range (-40 to 85°C). Ideal for telecom applications as a line equalizer IC due to its low supply current of 0.077mA.

Median Price

$7.853

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 266 parts In-Stock

1+ parts

$5.897

100+ parts

$4.901

1k+ parts

$4.540

10k+ parts

-

266

$5.897

$4.901

$4.540

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Texas Instruments

USA . 41,999 parts In-Stock

1+ parts

$7.853

100+ parts

$6.402

1k+ parts

$4.268

10k+ parts

-

41,999

$7.853

$6.402

$4.268

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Mouser Electronics

USA . 1,089 parts In-Stock

1+ parts

$11.020

100+ parts

$7.370

1k+ parts

$6.710

10k+ parts

-

1,089

$11.020

$7.370

$6.710

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DigiKey

USA . 2,063 parts In-Stock

1+ parts

$11.350

100+ parts

$7.589

1k+ parts

$6.912

10k+ parts

-

2,063

$11.350

$7.589

$6.912

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Chip1Stop

Japan . 11 parts In-Stock

1+ parts

$12.300

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-

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11

$12.300

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-

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Farnell

UK . 399 parts In-Stock

1+ parts

-

100+ parts

$5.400

1k+ parts

$5.170

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-

399

-

$5.400

$5.170

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Element14

Singapore . 399 parts In-Stock

1+ parts

-

100+ parts

$10.700

1k+ parts

$9.960

10k+ parts

-

399

-

$10.700

$9.960

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Verical

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$4.901

1k+ parts

$4.540

10k+ parts

-

266

-

$4.901

$4.540

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Rochester

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$6.140

1k+ parts

$5.490

10k+ parts

$5.170

53

-

$6.140

$5.490

$5.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,907 parts In-Stock

1+ parts

$4.750

100+ parts

-

1k+ parts

-

10k+ parts

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4,907

$4.750

-

-

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Digiode

USA . 4,759 parts In-Stock

1+ parts

$5.415

100+ parts

-

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4,759

$5.415

-

-

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Chip Stock

USA . 9,400 parts In-Stock

1+ parts

-

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9,400

-

-

-

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Component Sense

UK . 525 parts In-Stock

1+ parts

-

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525

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Anansix

USA . 287 parts In-Stock

1+ parts

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287

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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-

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10

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-

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Speed Components Ltd

Israel . 6 parts In-Stock

1+ parts

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,010 parts In-Stock

1+ parts

$4.840

100+ parts

-

1k+ parts

-

10k+ parts

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5,010

$4.840

-

-

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Corphita

USA . 577 parts In-Stock

1+ parts

$5.130

100+ parts

-

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-

10k+ parts

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577

$5.130

-

-

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Continental Prestige Electronics

USA . 766 parts In-Stock

1+ parts

$9.450

100+ parts

$6.670

1k+ parts

-

10k+ parts

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766

$9.450

$6.670

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Parana Technologies

USA . 1,111 parts In-Stock

1+ parts

$13.335

100+ parts

$1,238.345

1k+ parts

$12.001

10k+ parts

-

1,111

$13.335

$1,238.345

$12.001

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DigiPath Technology Company

USA . 1,348 parts In-Stock

1+ parts

$14.683

100+ parts

-

1k+ parts

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10k+ parts

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1,348

$14.683

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-

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ChromeModa Solutions

Germany . 4,907 parts In-Stock

1+ parts

$14.983

100+ parts

$12.286

1k+ parts

-

10k+ parts

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4,907

$14.983

$12.286

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IDEA Electronic Components Group

UK . 926 parts In-Stock

1+ parts

$14.983

100+ parts

$14.234

1k+ parts

$13.485

10k+ parts

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926

$14.983

$14.234

$13.485

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QUARKTWIN TECHNOLOGY LTD

USA . 11,473 parts In-Stock

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11,473

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Lixinc

USA . 9,432 parts In-Stock

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9,432

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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Perfect Parts

USA . 3,367 parts In-Stock

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3,367

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 800 parts In-Stock

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800

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-

Overview

Enhance your analog data transmission experience with the DS15EA101SQ/NOPB by Texas Instruments. Crafted with precision and reliability in mind, this cutting-edge product offers unparalleled quality and performance. Perfect for a wide range of applications, this line equalizer telecom IC provides exceptional value and benefits to customers seeking seamless connectivity and efficient data transmission. Trust Texas Instruments for top-of-the-line technology that enhances your digital communication experience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost.

Package Shape: SQUARE

Square package shape helps with efficient use of space on the circuit board.

Power Supplies (V): 3.3

Operates on a standard 3.3V power supply, making it compatible with a wide range of systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to various components, providing flexibility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles allow for different mounting options and heat dissipation capabilities, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures, making it suitable for industrial applications where temperature can fluctuate.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme conditions, increasing the product's reliability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easy integration into quad flat packages or quad flat no-lead packages, enhancing compatibility.

Maximum Seated Height: 0.8 mm

Low seated height helps in minimizing the overall profile of the product, making it suitable for compact designs.

Width: 4 mm

Compact width enables space-saving placement on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand manufacturing processes.

Length: 4 mm

Compact length allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures reliability in harsh operating conditions.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and complies with RoHS regulations.

Maximum Supply Current: 0.077 mA

Low supply current consumption helps in energy efficiency in the overall system.

Telecom IC Type: LINE EQUALIZER

Specific IC type designed for telecom applications, providing enhanced signal quality in transmission.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly and storage.

Technical Specifications

Analog Data Transmission Interfaces DS15EA101SQ/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.077 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

DS15EA101SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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