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DS15EA101SQX/NOPB

Texas Instruments

DS15EA101SQX/NOPB by Texas Instruments

DS15EA101SQX/NOPB by Texas Instruments is a 16-terminal analog data transmission interface with 3.3V supply voltage, operating b/w -40 to 85°C. It features a square package shape, matte tin terminal finish, and is ideal for telecom applications as a line equalizer IC.

Median Price

$5.960

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,902 parts In-Stock

1+ parts

-

100+ parts

$5.160

1k+ parts

$4.620

10k+ parts

$4.340

19,902

-

$5.160

$4.620

$4.340

DigiKey

USA . 19,902 parts In-Stock

1+ parts

-

100+ parts

$5.960

1k+ parts

-

10k+ parts

-

19,902

-

$5.960

-

-

Verical

USA . 19,902 parts In-Stock

1+ parts

-

100+ parts

$6.450

1k+ parts

$5.775

10k+ parts

$5.425

19,902

-

$6.450

$5.775

$5.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$5.120

-

-

-

Digiode

USA . 4,291 parts In-Stock

1+ parts

$5.444

100+ parts

-

1k+ parts

-

10k+ parts

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4,291

$5.444

-

-

-

DigiKey Marketplace

USA . 19,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,902

-

-

-

-

Vyrian

USA . 19,809 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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19,809

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-

-

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Anansix

USA . 125 parts In-Stock

1+ parts

-

100+ parts

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125

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19,744 parts In-Stock

1+ parts

$4.870

100+ parts

-

1k+ parts

-

10k+ parts

-

19,744

$4.870

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$5.120

-

-

-

Corphita

USA . 4,497 parts In-Stock

1+ parts

$5.157

100+ parts

-

1k+ parts

-

10k+ parts

-

4,497

$5.157

-

-

-

Parana Technologies

USA . 1,558 parts In-Stock

1+ parts

$8.672

100+ parts

-

1k+ parts

$9.349

10k+ parts

-

1,558

$8.672

-

$9.349

-

DigiPath Technology Company

USA . 58 parts In-Stock

1+ parts

$9.549

100+ parts

$8.785

1k+ parts

-

10k+ parts

-

58

$9.549

$8.785

-

-

ChromeModa Solutions

Germany . 5,490 parts In-Stock

1+ parts

$9.744

100+ parts

$7.990

1k+ parts

-

10k+ parts

-

5,490

$9.744

$7.990

-

-

IDEA Electronic Components Group

UK . 2,022 parts In-Stock

1+ parts

$9.744

100+ parts

$9.257

1k+ parts

$8.770

10k+ parts

-

2,022

$9.744

$9.257

$8.770

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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15,000

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Kepictronics

USA . 4,500 parts In-Stock

1+ parts

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100+ parts

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4,500

-

-

-

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Glotronic Ltd.

UK . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,500

-

-

-

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Microchip USA

USA . 458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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458

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-

Overview

Enhance your analog data transmission interfaces with the DS15EA101SQX/NOPB by Texas Instruments. Manufactured with precision and reliability in mind, this square package chip carrier is designed to meet industrial temperature requirements while providing a seamless terminal position for easy integration. Perfect for telecom applications, this line equalizer offers a nominal supply voltage of 3.3V and a low supply current of 0.077 mA, ensuring optimal performance without compromising on efficiency. Upgrade your systems with this high-quality solution and experience unparalleled value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, making this product a convenient choice for manufacturers.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with a wide range of existing systems and devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product is suitable for industrial environments where temperatures can fluctuate.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40°C makes this product reliable even in harsh and extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good conductivity and solderability, ensuring a reliable connection.

Maximum Seated Height: 0.8 mm

With a low maximum seated height of 0.8mm, this product is suitable for applications where space is limited.

Telecom IC Type: LINE EQUALIZER

Being a line equalizer, this product helps in minimizing signal distortion and maintaining signal integrity over long transmission distances.

Technical Specifications

Analog Data Transmission Interfaces DS15EA101SQX/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.077 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

DS15EA101SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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