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DM7489J/A+

Texas Instruments

DM7489J/A+ by Texas Instruments

The Texas Instruments DM7489J/A+ is a 16x4 SRAM with TTL technology, operating at 5V. It features open-collector outputs and through-hole terminals on a ceramic package. Ideal for commercial applications requiring reliable asynchronous memory storage in a 2.54mm terminal pitch format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,995 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,995

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Vyrian

USA . 2,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,336

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Anansix

USA . 1,761 parts In-Stock

1+ parts

-

100+ parts

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1,761

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 853 parts In-Stock

1+ parts

$0.172

100+ parts

-

1k+ parts

-

10k+ parts

$0.165

853

$0.172

-

-

$0.165

Northwest PG Solutions

USA . 1,742 parts In-Stock

1+ parts

$0.189

100+ parts

-

1k+ parts

-

10k+ parts

$0.167

1,742

$0.189

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-

$0.167

Parana Technologies

USA . 820 parts In-Stock

1+ parts

$3.151

100+ parts

-

1k+ parts

$3.670

10k+ parts

-

820

$3.151

-

$3.670

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DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

$3.470

100+ parts

$3.193

1k+ parts

-

10k+ parts

-

340

$3.470

$3.193

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ChromeModa Solutions

Germany . 1,974 parts In-Stock

1+ parts

$3.541

100+ parts

$2.904

1k+ parts

-

10k+ parts

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1,974

$3.541

$2.904

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IDEA Electronic Components Group

UK . 1,381 parts In-Stock

1+ parts

$3.541

100+ parts

-

1k+ parts

$3.187

10k+ parts

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1,381

$3.541

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$3.187

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AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$12.583

100+ parts

-

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808

$12.583

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One Stop Electronics

USA . 357 parts In-Stock

1+ parts

$18.000

100+ parts

-

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357

$18.000

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Corphita

USA . 4,137 parts In-Stock

1+ parts

-

100+ parts

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4,137

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Overview

Unleash the power of reliable memory storage with the Texas Instruments DM7489J/A+ SRAM. Crafted with precision and expertise, this product offers seamless operation in various applications. Experience the exceptional quality and efficiency that Texas Instruments is known for, providing unparalleled value and benefits to customers. Upgrade your system with the unmatched advantages of the DM7489J/A+, trusted by professionals worldwide.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent heat resistance and durability, ensuring reliable performance in various operating conditions.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and independent access to data, making it suitable for applications where timing is not critical.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage is widely compatible and easy to integrate into existing systems.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other devices and simplifies the design of multi-device systems.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the SRAM efficient and reliable.

Technical Specifications

SRAM DM7489J/A+ attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Memory IC Type:

Memory Width:

4

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16X4

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Sub-Category:

SRAMs

Maximum Supply Current:

120 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM7489J/A+ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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