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DM54LS377E

Texas Instruments

DM54LS377E by Texas Instruments

DM54LS377E by Texas Instruments is an 8-bit latches & flip-flops chip with a propagation delay of 25ns. Operating b/w -55 to 125°C, it has a supply voltage range of 4.5V to 5.5V and supports a max frequency of 30MHz. Ideal for military-grade applications requiring fast data storage and retrieval in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 6,075 parts In-Stock

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Vyrian

USA . 5,572 parts In-Stock

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5,572

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Anansix

USA . 853 parts In-Stock

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853

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One Stop Electronics

USA . 273 parts In-Stock

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$8.000

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273

$8.000

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AZTECH Wire

Italy . 345 parts In-Stock

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$8.484

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345

$8.484

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Parana Technologies

USA . 1,229 parts In-Stock

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$10.994

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$11.456

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1,229

$10.994

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$11.456

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ChromeModa Solutions

Germany . 3,185 parts In-Stock

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$12.353

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$10.129

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3,185

$12.353

$10.129

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IDEA Electronic Components Group

UK . 2,271 parts In-Stock

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$12.353

100+ parts

$11.735

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$11.118

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2,271

$12.353

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$11.118

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Native Components

USA . 396 parts In-Stock

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$45.270

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$43.459

396

$45.270

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$43.459

Northwest PG Solutions

USA . 1,604 parts In-Stock

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$49.797

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1,604

$49.797

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Corphita

USA . 3,370 parts In-Stock

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3,370

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DigiPath Technology Company

USA . 1,575 parts In-Stock

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$11.137

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1,575

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$11.137

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Supply Digital

USA . 602 parts In-Stock

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602

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Overview

Unleash the power of reliable data storage and transfer with the DM54LS377E by Texas Instruments. Crafted with precision and expertise, this latches & flip-flops device offers seamless integration and exceptional performance across various applications. With a focus on quality and innovation, Texas Instruments provides customers with a product that guarantees efficiency, durability, and value. Elevate your projects with the unmatched benefits and advantages of the DM54LS377E, setting new standards in the realm of electronic components.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable material ensures the latch or flip-flop is robust and reliable in various operating conditions.

Surface Mount: YES

Easy installation and integration onto circuit boards, saving assembly time and cost.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, widely available in electronic systems.

Propagation Delay (tpd): 25 ns

Fast signal processing speed, ideal for high-speed applications.

Minimum Operating Temperature: -55 °C

Can operate reliably in extreme low-temperature environments.

Technology: TTL

Utilizing TTL technology for improved performance and compatibility with other TTL devices.

Technical Specifications

Latches & Flip-Flops DM54LS377E attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

25 ns

Maximum Seated Height:

1.905 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Minimum fmax:

30 MHz

Trade Compliance

DM54LS377E Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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