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DM54LS259J

Texas Instruments

DM54LS259J by Texas Instruments

DM54LS259J by Texas Instruments is a TTL technology latch with 16 terminals and a supply voltage range of 4.5V to 5.5V. It has a propagation delay of 27ns, operates b/w -55°C to 125°C, and features low-level trigger type. This rectangular package is ideal for military-grade applications requiring true output polarity control.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,360 parts In-Stock

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Anansix

USA . 2,563 parts In-Stock

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Digiode

USA . 1,983 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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AZTECH Wire

Italy . 304 parts In-Stock

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$11.987

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304

$11.987

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One Stop Electronics

USA . 500 parts In-Stock

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$16.000

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500

$16.000

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Parana Technologies

USA . 2,177 parts In-Stock

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$29.860

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$2,772.908

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$26.874

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2,177

$29.860

$2,772.908

$26.874

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DigiPath Technology Company

USA . 327 parts In-Stock

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$32.879

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$30.249

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327

$32.879

$30.249

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ChromeModa Solutions

Germany . 2,342 parts In-Stock

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$33.550

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$27.511

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IDEA Electronic Components Group

UK . 208 parts In-Stock

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$33.550

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$31.872

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$30.195

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208

$33.550

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$30.195

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Corphita

USA . 3,234 parts In-Stock

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Supply Digital

USA . 2,889 parts In-Stock

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Native Components

USA . 485 parts In-Stock

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Northwest PG Solutions

USA . 106 parts In-Stock

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Overview

Enhance your electronic projects with the reliable DM54LS259J latches & flip-flops by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers unmatched performance in every product. Perfect for a wide range of applications, this versatile component offers fast propagation delay and true output polarity, ensuring efficient operation. Upgrade your designs with the value and benefits that the DM54LS259J provides, setting you up for success in all your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in electronics, making it compatible with a wide range of systems.

Propagation Delay (tpd): 27 ns

The low propagation delay of 27 ns ensures quick response times, making this latch efficient for time-sensitive applications.

Maximum Operating Temperature: 125 °C

The high operating temperature range of up to 125°C makes this latch suitable for harsh environmental conditions.

Technology: TTL

The TTL technology used in this latch provides reliable performance and compatibility with other TTL devices.

Technical Specifications

Latches & Flip-Flops DM54LS259J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH

Family:

LS

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

27 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

DM54LS259J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-485-0782, 5962014850782, 5962-99-790-6199, 5962997906199

NIIN

014850782, 997906199

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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