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DM54LS109AJ

Texas Instruments

DM54LS109AJ by Texas Instruments

DM54LS109AJ by Texas Instruments is a TTL technology latch with 2 functions, 35 ns propagation delay, and 5V nominal voltage. It is used in military-grade applications requiring positive edge triggering and complementary output polarity. With a max frequency of 20 MHz, it is ideal for high-speed operations in harsh environments.

Median Price

$21.070

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 42 parts In-Stock

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$21.070

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$22.123

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$20.859

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Vyrian

USA . 3,653 parts In-Stock

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Digiode

USA . 1,500 parts In-Stock

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Anansix

USA . 735 parts In-Stock

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Rebound Electronics

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Manoshevitz Elec. Sales

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Distributors (Availability)

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Native Components

USA . 960 parts In-Stock

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$0.520

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Northwest PG Solutions

USA . 1,497 parts In-Stock

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$0.572

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AZTECH Wire

Italy . 486 parts In-Stock

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$5.773

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Parana Technologies

USA . 2,315 parts In-Stock

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DigiPath Technology Company

USA . 422 parts In-Stock

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$32.756

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$30.135

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IDEA Electronic Components Group

UK . 1,566 parts In-Stock

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$31.753

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$30.082

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ChromeModa Solutions

Germany . 651 parts In-Stock

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One Stop Electronics

USA . 1,167 parts In-Stock

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Glotronic Ltd.

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Supply Digital

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Overview

Enhance your electronics projects with the DM54LS109AJ from Texas Instruments, a top-quality latches & flip-flops component that offers unmatched reliability and performance. With a MILITARY-grade temperature rating and a maximum operating frequency of 20 MHz, this product is perfect for applications requiring precise timing and data storage. Trust in Texas Instruments' reputation for excellence and invest in a product that delivers exceptional value and benefits to all your circuit designs. Experience the difference today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 35 ns

The low propagation delay ensures fast operation and response times, making this product suitable for time-sensitive applications.

No. of Functions: 2

Having multiple functions in one device offers versatility and efficiency in circuit design, saving space and reducing component count.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, suitable for industrial and military applications.

Technical Specifications

Latches & Flip-Flops DM54LS109AJ attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Family:

LS

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

8 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

DM54LS109AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-341-8080, 5962013418080

NIIN

013418080

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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