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CY74FCT377CTSOCE4

Texas Instruments

CY74FCT377CTSOCE4 by Texas Instruments

CY74FCT377CTSOCE4 by Texas Instruments is an 8-bit latch with a propagation delay of 5.2 ns, operating at a max frequency of 83.3 MHz. It features a true output polarity and positive edge trigger type, making it ideal for industrial applications requiring fast data storage and retrieval in compact spaces. With a small outline package style and surface mount capability, this CMOS technology-based device offers efficient performance within tight constraints.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

USA . 4,334 parts In-Stock

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AZTECH Wire

Italy . 192 parts In-Stock

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$9.932

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192

$9.932

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Parana Technologies

USA . 260 parts In-Stock

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$21.077

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-

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$21.329

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260

$21.077

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DigiPath Technology Company

USA . 166 parts In-Stock

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$23.208

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$21.352

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ChromeModa Solutions

Germany . 4,294 parts In-Stock

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$19.419

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IDEA Electronic Components Group

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$23.682

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$22.498

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$21.314

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One Stop Electronics

USA . 1,224 parts In-Stock

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$65.000

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Native Components

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Northwest PG Solutions

USA . 730 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the CY74FCT377CTSOCE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality latches & flip-flops that offer unparalleled performance and reliability. Whether you're working on consumer electronics, industrial automation, or telecommunications, this product provides fast propagation delay and 3-STATE output characteristics to optimize your designs. With a small outline package style and industrial temperature grade, the CY74FCT377CTSOCE4 is the perfect choice for your next project. Elevate your creations with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch durable and resistant to external elements, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 5.2 ns

The low propagation delay of 5.2 ns ensures quick response times and efficient operation of the latch.

Surface Mount: YES

Being surface mountable makes the latch easy to install and saves space on the PCB.

No. of Bits: 8

With 8 bits, this latch can handle a range of data inputs, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most electronic systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stability in signal transmission and reception.

Power Supplies (V): 5

Having multiple power supplies at 5V ensures reliable and consistent performance.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and flexibility in circuit design.

Maximum I (ol): 64 Amp

The high maximum output current of 64 Amp ensures compatibility with a wide range of devices and components.

Output Characteristics: 3-STATE

The 3-state output allows for tristate logic, enabling a high level of control and flexibility in the output signal.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate and reliable latch operation based on rising edges of the input signals.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this latch can function in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this latch suitable for use in various climates and industrial settings.

Width: 7.5 mm

The compact width of 7.5 mm allows for efficient use of space on the PCB.

Output Polarity: TRUE

Having true output polarity ensures accurate signal representation and compatibility with other components in the system.

Maximum Frequency At Nominal Supply: 83300000 Hz

With a high maximum frequency of 83.3 MHz, this latch can handle high-speed data processing and communication.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and high noise immunity, making it an efficient choice for electronic systems.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connections on the PCB.

Packing Method: TUBE

The tube packing method provides convenient storage and protection for the latch during shipping and handling.

Technical Specifications

Latches & Flip-Flops CY74FCT377CTSOCE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

83300000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT377CTSOCE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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