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CY74FCT373ATQCTE4

Texas Instruments

CY74FCT373ATQCTE4 by Texas Instruments

CY74FCT373ATQCTE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.2ns and output polarity TRUE. It operates at a nominal voltage of 5V, has a max I (ol) of 64A, and is suitable for industrial applications requiring CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,488 parts In-Stock

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Digiode

USA . 1,721 parts In-Stock

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Native Components

USA . 816 parts In-Stock

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$1.656

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Northwest PG Solutions

USA . 1,956 parts In-Stock

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$1.822

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AZTECH Wire

Italy . 610 parts In-Stock

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$8.659

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Andel Nordic

Denmark . 4,514 parts In-Stock

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$10.616

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$10.191

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4,514

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$10.191

Parana Technologies

USA . 1,182 parts In-Stock

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$18.380

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$18.506

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DigiPath Technology Company

USA . 1,023 parts In-Stock

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$20.239

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$18.620

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ChromeModa Solutions

Germany . 2,292 parts In-Stock

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$20.652

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$16.935

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IDEA Electronic Components Group

UK . 721 parts In-Stock

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$20.652

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$19.619

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$18.587

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721

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One Stop Electronics

USA . 1,606 parts In-Stock

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$42.000

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Component Stockers USA

USA . 760 parts In-Stock

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$99.990

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Corphita

USA . 3,088 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the CY74FCT373ATQCTE4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This Bus Driver & Transceiver offers seamless communication between components, ensuring optimal performance. With a compact design and advanced technology, this product provides fast propagation delay and low power consumption, making it ideal for industrial applications. Upgrade your projects with this high-quality component and experience superior efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and heat resistance for reliable performance in various operating conditions.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast data transmission and response time, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatibility with a standard 5V supply voltage ensures easy integration with existing systems and components.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other devices, reducing errors and signal disruptions.

Temperature Grade: INDUSTRIAL

Industrial temperature grade design allows for reliable operation in harsh environmental conditions and extended temperature ranges.

Technical Specifications

Bus Driver & Transceivers CY74FCT373ATQCTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.2 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

3.9 mm

Trade Compliance

CY74FCT373ATQCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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