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CY74FCT16244TPVCT

Texas Instruments

CY74FCT16244TPVCT by Texas Instruments

CY74FCT16244TPVCT by Texas Instruments is a 4-bit bus driver with 6.5 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and has a max operating temperature of 85°C. With surface mount capability and dual terminal position, it offers reliable performance in various electronic systems.

Median Price

$1.986

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.986

100+ parts

-

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10

$1.986

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Digiode

USA . 4,148 parts In-Stock

1+ parts

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4,148

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Vyrian

USA . 443 parts In-Stock

1+ parts

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443

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,168 parts In-Stock

1+ parts

$1.986

100+ parts

-

1k+ parts

-

10k+ parts

$1.946

6,168

$1.986

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-

$1.946

Argo Parts USA

USA . 1,429 parts In-Stock

1+ parts

$1.986

100+ parts

-

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1,429

$1.986

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Andel Nordic

Denmark . 3,848 parts In-Stock

1+ parts

$9.452

100+ parts

-

1k+ parts

$9.074

10k+ parts

$9.074

3,848

$9.452

-

$9.074

$9.074

Parana Technologies

USA . 676 parts In-Stock

1+ parts

$11.107

100+ parts

-

1k+ parts

$11.563

10k+ parts

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676

$11.107

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$11.563

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AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$11.801

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626

$11.801

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DigiPath Technology Company

USA . 1,697 parts In-Stock

1+ parts

$12.230

100+ parts

$11.252

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1,697

$12.230

$11.252

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ChromeModa Solutions

Germany . 2,411 parts In-Stock

1+ parts

$12.480

100+ parts

$10.234

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2,411

$12.480

$10.234

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IDEA Electronic Components Group

UK . 1,881 parts In-Stock

1+ parts

$12.480

100+ parts

$11.856

1k+ parts

$11.232

10k+ parts

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1,881

$12.480

$11.856

$11.232

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One Stop Electronics

USA . 1,123 parts In-Stock

1+ parts

$27.000

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1,123

$27.000

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Ampacity Inc.

Singapore . 1,184 parts In-Stock

1+ parts

$53.000

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1,184

$53.000

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Corphita

USA . 4,341 parts In-Stock

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4,341

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Microchip USA

USA . 351 parts In-Stock

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351

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Overview

Enhance your electronic designs with the CY74FCT16244TPVCT by Texas Instruments. This high-quality bus driver & transceiver offers outstanding performance and reliability, thanks to the reputable manufacturer's expertise. Ideal for a wide range of applications, this product provides exceptional value with its advanced features and capabilities. Experience seamless connectivity and efficient signal transmission with the CY74FCT16244TPVCT, delivering unmatched benefits and advantages to meet your project requirements. Elevate your projects with Texas Instruments' top-notch technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures fast and efficient data transmission.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards.

No. of Functions: 4

Having multiple functions in one device can help streamline circuit design and save space.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage supply, making integration into existing systems easier.

Load Capacitance (CL): 50 pF

Optimized load capacitance for efficient signal transmission.

Power Supplies (V): 5

Consistent power supply ensures stable performance.

No. of Terminals: 48

Sufficient terminals for versatile connectivity options.

Maximum I (ol): 64 Amp

High output current capability for driving multiple loads.

Propagation Delay (tpd): 6.5 ns

Low propagation delay for fast data transmission.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signals.

Technical Specifications

Bus Driver & Transceivers CY74FCT16244TPVCT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

CY74FCT16244TPVCT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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