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CY74FCT240ATQCTG4

Texas Instruments

CY74FCT240ATQCTG4 by Texas Instruments

CY74FCT240ATQCTG4 by Texas Instruments is a 20-terminal bus driver with 4.8ns propagation delay and 64A max I (ol). It operates at -40 to 85°C, suitable for industrial applications requiring inverted output polarity and enable low control type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,689 parts In-Stock

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Digiode

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Parana Technologies

USA . 832 parts In-Stock

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$10.012

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DigiPath Technology Company

USA . 79 parts In-Stock

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$10.143

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IDEA Electronic Components Group

UK . 1,402 parts In-Stock

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ChromeModa Solutions

Germany . 410 parts In-Stock

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$9.225

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AZTECH Wire

Italy . 408 parts In-Stock

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One Stop Electronics

USA . 1,501 parts In-Stock

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Microchip USA

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Corphita

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Native Components

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Northwest PG Solutions

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Overview

Upgrade your electronics with the CY74FCT240ATQCTG4 from Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers top-of-the-line bus drivers and transceivers that are perfect for a wide range of applications. This versatile chip offers customers unparalleled value, benefits, and advantages, making it an essential component for any project. Trust Texas Instruments to provide reliable solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making the product suitable for a variety of environments and conditions.

Propagation Delay At Nominal Supply: 4.8 ns

Low propagation delay ensures quick signal transmission, making the product efficient for high-speed data communication.

Surface Mount: YES

The surface mount capability makes installation easy and saves space, ideal for compact electronic designs.

No. of Functions: 2

Having multiple functions in one device adds versatility and convenience to the product's application.

Nominal Supply Voltage / Vsup (V): 5

Matching nominal supply voltage with most common power sources ensures compatibility and ease of integration.

No. of Bits: 4

With 4 bits, the product can handle moderate complexity in data processing, suitable for a range of applications.

Load Capacitance (CL): 50 pF

The low load capacitance minimizes signal distortion and ensures accurate data transmission.

Maximum Operating Temperature: 85 °C

The wide temperature range allows the product to operate in various environmental conditions without performance degradation.

No. of Ports: 2

Having multiple ports provides flexibility in connecting to different devices or systems, enhancing the product's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and signal integrity.

Technical Specifications

Bus Driver & Transceivers CY74FCT240ATQCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.2 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CY74FCT240ATQCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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