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CSD25302Q2

Texas Instruments

CSD25302Q2 by Texas Instruments

CSD25302Q2 by Texas Instruments is a P-CHANNEL FET for SWITCHING applications. It features 20V DS Breakdown Voltage, 5A Drain Current, and 0.092 ohm On Resistance. With a max power dissipation of 2.4W and operating temperature of 150°C, it's ideal for high-performance electronic devices.

Median Price

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Lifecycle Status

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10

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Digiode

USA . 3,711 parts In-Stock

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Vyrian

USA . 2,414 parts In-Stock

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Connector Distribution Corp

USA . 1,253 parts In-Stock

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Right Parts Inc.

USA . 1,253 parts In-Stock

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Bristol Electronics

USA . 311 parts In-Stock

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Pegasus Components GmbH

Germany . 200 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 186 parts In-Stock

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Sea View Technologies

USA . 180 parts In-Stock

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A2Z Electronics, Inc.

USA . 131 parts In-Stock

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Parana Technologies

USA . 518 parts In-Stock

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$0.846

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$1.803

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518

$0.846

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$1.803

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DigiPath Technology Company

USA . 1,291 parts In-Stock

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$0.931

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$0.857

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$0.931

$0.857

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ChromeModa Solutions

Germany . 2,567 parts In-Stock

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$0.950

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$0.779

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$0.950

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IDEA Electronic Components Group

UK . 715 parts In-Stock

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$0.950

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$0.855

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Native Components

USA . 406 parts In-Stock

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$1.940

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Northwest PG Solutions

USA . 974 parts In-Stock

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$2.134

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Andel Nordic

Denmark . 4,254 parts In-Stock

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$6.114

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$5.870

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AZTECH Wire

Italy . 429 parts In-Stock

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$15.483

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One Stop Electronics

USA . 468 parts In-Stock

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$47.050

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Assy Fe

Spain . 84,689 parts In-Stock

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Futuretech Components

Singapore . 34,689 parts In-Stock

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Authorized Procurement Solutions

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Metaverse IC Inc.

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A-Z Elektronik GmbH

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Alle Elektronik GmbH

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Corphita

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Lixinc

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ChipstoGo Electronic ltd

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Overview

Unlock the power of cutting-edge technology with the CSD25302Q2 by Texas Instruments. As a leading manufacturer in the industry, this P-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability for a wide range of applications. With a single configuration and built-in diode, this transistor is perfect for switching operations. Experience enhanced efficiency and superior functionality with the CSD25302Q2, delivering exceptional value and benefits to customers seeking top-notch quality in their electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the FET, making it suitable for various applications while keeping it cost-effective.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance which can improve efficiency in power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high efficiency and reliability in controlling power flow.

Surface Mount: YES

Facilitates easy and compact placement on circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 20 V

With a voltage rating of 20V, this FET is suitable for low to medium voltage applications, offering reliable performance within its specified range.

Package Shape: SQUARE

The square shape allows for efficient placement and soldering on the PCB, optimizing space utilization.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and reduce the risk of soldering defects, ensuring long-term performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation, enabling precise and efficient power management.

Maximum Pulsed Drain Current (IDM): 20 A

Capable of handling high peak currents, making it suitable for applications requiring brief periods of increased power output.

Maximum Drain Current (Abs) (ID): 5 A

Sustains a continuous drain current of 5A, suitable for various low to medium power applications.

No. of Terminals: 6

Provides multiple connection points for versatile circuit configurations, enhancing the FET's compatibility with different setups.

Maximum Power Dissipation (Abs): 2.4 W

Can dissipate up to 2.4W of power without overheating, ensuring reliable operation under specified load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package design saves space on the PCB, ideal for compact electronic devices or densely populated circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology known for its high switching speeds and low on-resistance, improving overall performance efficiency.

Maximum Operating Temperature: 150 °C

Can operate reliably at temperatures up to 150°C, suitable for applications where elevated temperatures may be encountered.

Transistor Element Material: SILICON

Silicon-based construction ensures stable and consistent performance over a wide temperature range, making it a reliable choice for various applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a strong and durable electrical connection.

Maximum Drain-Source On Resistance: 0.092 ohm

Low on-resistance minimizes power loss and heat generation, improving efficiency in power switching applications.

Terminal Position: DUAL

Dual terminal configuration offers flexibility in circuit design and connection options, allowing for versatile application scenarios.

Case Connection: SOURCE

Source connection simplifies circuit layout and improves thermal management, enhancing the overall performance and reliability of the FET.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperature of 260°C, suitable for lead-free soldering processes and ensuring robust solder joints.

Technical Specifications

Power Field Effect Transistors (FET) CSD25302Q2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.092 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD25302Q2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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