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CP3CN17G38X

Texas Instruments

CP3CN17G38X by Texas Instruments

CP3CN17G38X by Texas Instruments is a 16-bit microprocessor with integrated cache and 22-bit address bus width. It operates b/w -40 to 85 °C, suitable for industrial applications requiring low power consumption and high-speed processing. The package style is flatpack, low profile, fine pitch with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,182 parts In-Stock

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Anansix

USA . 2,539 parts In-Stock

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2,539

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Digiode

USA . 1,965 parts In-Stock

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1,965

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Distributors (Availability)

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Native Components

USA . 60 parts In-Stock

1+ parts

$0.883

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60

$0.883

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Northwest PG Solutions

USA . 1,134 parts In-Stock

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$0.972

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1,134

$0.972

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One Stop Electronics

USA . 1,535 parts In-Stock

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$3.000

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1,535

$3.000

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AZTECH Wire

Italy . 850 parts In-Stock

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$6.184

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850

$6.184

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Parana Technologies

USA . 1,610 parts In-Stock

1+ parts

$40.944

100+ parts

$3,802.231

1k+ parts

$36.849

10k+ parts

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1,610

$40.944

$3,802.231

$36.849

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DigiPath Technology Company

USA . 1,021 parts In-Stock

1+ parts

$45.084

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1,021

$45.084

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ChromeModa Solutions

Germany . 4,387 parts In-Stock

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$46.004

100+ parts

$37.723

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4,387

$46.004

$37.723

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IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$46.004

100+ parts

$43.704

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$41.404

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1,240

$46.004

$43.704

$41.404

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Corphita

USA . 1,172 parts In-Stock

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1,172

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Overview

Unlock the power of innovation with the CP3CN17G38X by Texas Instruments, a cutting-edge microprocessor designed to deliver superior performance and reliability. Manufactured by a trusted industry leader, this versatile component is ideal for a wide range of applications in industrial settings. Experience seamless integration, enhanced efficiency, and unmatched precision with this high-quality product. Elevate your projects to new heights with the CP3CN17G38X and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Integrated Cache: YES

Integrated cache improves the performance of the microprocessor by storing frequently accessed data and instructions, resulting in faster processing speeds.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

The higher maximum supply voltage provides flexibility in power input options and allows for stable operation under varying voltage conditions.

Address Bus Width: 22

The 22-bit address bus width enables access to a larger memory address space, making this microprocessor suitable for applications requiring extensive memory capabilities.

Package Shape: SQUARE

The square package shape offers uniformity and ease of handling during manufacturing and assembly processes.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data in smaller chunks, suitable for applications with moderate computational requirements.

No. of Terminals: 100

The higher number of terminals provide connectivity options for various peripheral devices and components, enhancing the versatility of the microprocessor.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for dense packing on PCBs, improving overall system space utilization and reducing signal interference.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage ensures reliable operation even under low power conditions, making this microprocessor suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, making this microprocessor suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance, making this microprocessor suitable for a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position simplifies the connection and integration process, enabling easy and secure attachment to the PCB.

Maximum Seated Height: 1.6 mm

The low maximum seated height facilitates compact PCB design, reducing overall system size and enabling integration in space-constrained applications.

Width: 14 mm

The 14mm width offers compatibility with standard PCB layouts, ensuring easy integration into existing system designs.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the microprocessor during production and maintenance, enhancing overall system reliability.

External Data Bus Width: 16

The 16-bit external data bus width enables faster data transfer between the microprocessor and external devices, improving system performance and throughput.

Length: 14 mm

The 14mm length offers a compact form factor, ideal for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making this microprocessor suitable for demanding industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor with RISC architecture offers enhanced processing efficiency and speed, making it a suitable choice for applications requiring high computational capabilities.

Technology: CMOS

The CMOS technology used in this microprocessor allows for low power consumption, reducing overall energy usage and enabling operation in battery-powered devices.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable soldering connections on the PCB, ensuring long-term stability and performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V offers a balanced power input option, providing stable operation and optimal performance for various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on PCBs, enabling compact system designs and efficient use of PCB real estate.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations and data processing tasks, making this microprocessor suitable for applications requiring precision and accuracy.

Speed: 24 rpm

The processing speed of 24 rpm ensures fast and efficient data processing, suitable for real-time applications and tasks requiring quick response times.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation, reducing power consumption and extending battery life in portable and energy-sensitive applications.

Technical Specifications

Microprocessors CP3CN17G38X attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3CN17G38X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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