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CP3CN17K38Y

Texas Instruments

CP3CN17K38Y by Texas Instruments

CP3CN17K38Y by Texas Instruments is a 16-bit microprocessor with integrated cache and external data bus width of 16. It operates in industrial temperature range (-40 to 85 °C) and features low power mode, suitable for various RISC applications requiring high-speed processing in compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,029 parts In-Stock

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8,029

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Digiode

USA . 5,223 parts In-Stock

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5,223

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Anansix

USA . 2,589 parts In-Stock

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2,589

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Distributors (Availability)

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One Stop Electronics

USA . 510 parts In-Stock

1+ parts

$10.000

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510

$10.000

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Native Components

USA . 708 parts In-Stock

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$10.990

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708

$10.990

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Northwest PG Solutions

USA . 1,227 parts In-Stock

1+ parts

$12.089

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$10.880

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1,227

$12.089

$10.880

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AZTECH Wire

Italy . 857 parts In-Stock

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$19.231

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857

$19.231

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Parana Technologies

USA . 443 parts In-Stock

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$22.893

100+ parts

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$23.553

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443

$22.893

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$23.553

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DigiPath Technology Company

USA . 20 parts In-Stock

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$25.208

100+ parts

$23.191

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20

$25.208

$23.191

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ChromeModa Solutions

Germany . 3,870 parts In-Stock

1+ parts

$25.722

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$21.092

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3,870

$25.722

$21.092

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IDEA Electronic Components Group

UK . 191 parts In-Stock

1+ parts

$25.722

100+ parts

$24.436

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$23.150

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191

$25.722

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$23.150

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Corphita

USA . 4,948 parts In-Stock

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Overview

Enhance your electronic designs with the CP3CN17K38Y by Texas Instruments, a high-quality microprocessor that offers integrated cache and surface mount capabilities. Manufactured by a trusted industry leader, this versatile chip is perfect for a wide range of applications in the technology sector. With its impressive features and reliable performance, this product delivers exceptional value and benefits to customers looking for efficient and innovative solutions. Upgrade your projects today with the CP3CN17K38Y and experience the advantages it brings to your designs.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by providing fast access to frequently used data and instructions.

Surface Mount: YES

Surface mount technology makes installation easier and allows for a compact design, saving space on the PCB.

Maximum Supply Voltage: 2.75 V

Operating at a higher supply voltage allows for better performance and processing capabilities.

Address Bus Width: 22

A wider address bus allows for higher memory addressing capacity and faster data retrieval.

Package Shape: SQUARE

Square package shape provides efficient use of board space and easier layout in PCB designs.

Bit Size: 16

A 16-bit architecture provides a good balance between performance and power consumption for various applications.

No. of Terminals: 48

Having more terminals allows for more connectivity options and integration with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal performance and protection for the microprocessor.

Minimum Supply Voltage: 2.25 V

Operating at a lower supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Being able to operate at higher temperatures makes this microprocessor suitable for industrial applications with demanding environments.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this microprocessor can also be used in extreme cold conditions without compromising performance.

Terminal Position: QUAD

Quad terminal position allows for better stability and connectivity in the PCB assembly.

Maximum Seated Height: 1.1 mm

Low seated height helps in reducing overall profile and enables compact designs.

Width: 7 mm

Compact width dimension allows for placement in tight spaces and smaller form factor devices.

Boundary Scan: YES

Having boundary scan capability aids in testing and debugging during development and production phases.

External Data Bus Width: 16

16-bit external data bus width allows for efficient data transfer between the microprocessor and peripherals.

Length: 7 mm

Short length dimension makes this microprocessor suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures reliable operation in harsh environments.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers efficient execution of instructions and is suitable for a range of embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this microprocessor energy-efficient.

Nominal Supply Voltage: 2.5 V

Operates at a standard supply voltage level for compatibility with various power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and enables compact PCB designs.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and enhances performance in specific applications.

Speed: 24 rpm

24 rpm speed rating indicates the processing capability of this microprocessor for tasks requiring high speed.

Low Power Mode: YES

Having a low power mode helps in reducing power consumption during idle or low-demand operations, increasing overall efficiency.

Technical Specifications

Microprocessors CP3CN17K38Y attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.1 mm

Speed:

24 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CP3CN17K38Y Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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