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CLVCC3245AIDBREP

Texas Instruments

CLVCC3245AIDBREP by Texas Instruments

CLVCC3245AIDBREP by Texas Instruments is an 8-bit bus driver with 3V & 3/5V translation, 7.6 ns propagation delay, and 24 terminals. It operates at a nominal voltage of 3.3V, has a load capacitance of 50 pF, and supports industrial temperature grades. Ideal for bidirectional applications requiring common control in compact designs.

Median Price

$2.990

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,212 parts In-Stock

1+ parts

$2.990

100+ parts

$2.620

1k+ parts

$1.480

10k+ parts

-

15,212

$2.990

$2.620

$1.480

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,384 parts In-Stock

1+ parts

$2.840

100+ parts

-

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-

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3,384

$2.840

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Vyrian

USA . 4,652 parts In-Stock

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4,652

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Distributors (Availability)

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Corphita

USA . 1,372 parts In-Stock

1+ parts

$2.691

100+ parts

-

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-

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1,372

$2.691

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-

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Andel Nordic

Denmark . 4,800 parts In-Stock

1+ parts

$7.900

100+ parts

-

1k+ parts

$7.584

10k+ parts

$7.584

4,800

$7.900

-

$7.584

$7.584

Parana Technologies

USA . 443 parts In-Stock

1+ parts

$8.675

100+ parts

-

1k+ parts

$9.355

10k+ parts

-

443

$8.675

-

$9.355

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DigiPath Technology Company

USA . 2,230 parts In-Stock

1+ parts

$9.552

100+ parts

$8.788

1k+ parts

-

10k+ parts

-

2,230

$9.552

$8.788

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IDEA Electronic Components Group

UK . 2,283 parts In-Stock

1+ parts

$9.747

100+ parts

$9.260

1k+ parts

$8.772

10k+ parts

-

2,283

$9.747

$9.260

$8.772

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ChromeModa Solutions

Germany . 1,996 parts In-Stock

1+ parts

$9.747

100+ parts

$7.993

1k+ parts

-

10k+ parts

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1,996

$9.747

$7.993

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$17.190

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483

$17.190

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A-Z Elektronik GmbH

Germany . 6,689 parts In-Stock

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6,689

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Alle Elektronik GmbH

Germany . 4,459 parts In-Stock

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4,459

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Northwest PG Solutions

USA . 2,098 parts In-Stock

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2,098

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Native Components

USA . 508 parts In-Stock

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508

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Overview

Upgrade your electronic systems with the CLVCC3245AIDBREP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in their Bus Driver & Transceivers category. This product offers seamless translation between 3V and 3/5V, with a fast propagation delay of just 7.6 ns. With 8 bits and 3-state output characteristics, this small outline package is perfect for industrial applications. Trust Texas Instruments to provide reliable and efficient solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for use in transportation vehicles.

Propagation Delay At Nominal Supply: 7.6 ns

Low propagation delay ensures fast and efficient data transmission within the bus system, improving overall performance.

Surface Mount: YES

Surface mounting capability makes the product easy to install and saves valuable space on the PCB.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for use in industrial environments where temperature fluctuations may occur.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers CLVCC3245AIDBREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A; 3V TO 5.5V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Maximum Power Supply Current (ICC):

.13 mA

Propagation Delay At Nominal Supply:

7.6 ns

Propagation Delay (tpd):

11.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 3/5V

Width:

5.3 mm

Trade Compliance

CLVCC3245AIDBREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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