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CDCVF310PWRG4

Texas Instruments

CDCVF310PWRG4 by Texas Instruments

CDCVF310PWRG4 clock driver by Texas Instruments features a 4 ns propagation delay at 2.5V, with 24 terminals in a small outline package. Ideal for industrial applications requiring a max operating temperature of 85°C, it offers 3-state output characteristics and supports up to 200 MHz frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,968 parts In-Stock

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4,968

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Digiode

USA . 4,210 parts In-Stock

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4,210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 455 parts In-Stock

1+ parts

$0.669

100+ parts

-

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455

$0.669

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Northwest PG Solutions

USA . 1,066 parts In-Stock

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$0.735

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-

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1,066

$0.735

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Andel Nordic

Denmark . 4,984 parts In-Stock

1+ parts

$4.828

100+ parts

-

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$4.635

10k+ parts

$4.635

4,984

$4.828

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$4.635

$4.635

Parana Technologies

USA . 1,129 parts In-Stock

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$7.185

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$7.694

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1,129

$7.185

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$7.694

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IDEA Electronic Components Group

UK . 2,172 parts In-Stock

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$8.073

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$7.266

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2,172

$8.073

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$7.266

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ChromeModa Solutions

Germany . 924 parts In-Stock

1+ parts

$8.073

100+ parts

$6.620

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924

$8.073

$6.620

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AZTECH Wire

Italy . 789 parts In-Stock

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$11.489

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789

$11.489

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One Stop Electronics

USA . 250 parts In-Stock

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$62.000

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250

$62.000

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Component Stockers USA

USA . 258 parts In-Stock

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$99.990

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Kepictronics

USA . 2,450 parts In-Stock

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Corphita

USA . 2,223 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,732 parts In-Stock

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DigiPath Technology Company

USA . 514 parts In-Stock

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$7.279

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514

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$7.279

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Microchip USA

USA . 385 parts In-Stock

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Overview

Discover the CDCVF310PWRG4 by Texas Instruments, a high-quality clock driver & buffer that offers unmatched performance and reliability. With a compact design and advanced technology, this product is perfect for a wide range of applications. Texas Instruments, known for their top-notch products, has created a solution that provides customers with precise timing and seamless synchronization. Increase efficiency and streamline operations with the CDCVF310PWRG4, offering exceptional value and benefits that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and resistant to heat, making it a reliable choice for electronic components.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures quick signal transmission and efficient performance.

Surface Mount: YES

Surface mount design allows for easy and secure placement on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Stable nominal supply voltage of 2.5V ensures consistent and reliable operation.

Power Supplies (V): 2.5/3.3

Support for multiple power supplies (2.5V and 3.3V) offers flexibility in design and compatibility with different systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C enables reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with a wide range of digital systems.

Technical Specifications

Clock Drivers & Buffers CDCVF310PWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

310

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.23 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

200 MHz

Trade Compliance

CDCVF310PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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