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CDCVF2510PWG4

Texas Instruments

CDCVF2510PWG4 by Texas Instruments

CDCVF2510PWG4 by Texas Instruments is a clock driver with 3.9ns propagation delay, suitable for applications requiring precise timing. It operates at a nominal voltage of 3.3V and has 10 true outputs with a max frequency of 175MHz. This surface-mount device features a small outline package ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,624 parts In-Stock

1+ parts

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6,624

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Digiode

USA . 2,995 parts In-Stock

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2,995

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 869 parts In-Stock

1+ parts

$1.649

100+ parts

-

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869

$1.649

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Northwest PG Solutions

USA . 1,158 parts In-Stock

1+ parts

$1.814

100+ parts

-

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1,158

$1.814

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Andel Nordic

Denmark . 5,525 parts In-Stock

1+ parts

$7.056

100+ parts

-

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$6.774

10k+ parts

$6.774

5,525

$7.056

-

$6.774

$6.774

AZTECH Wire

Italy . 700 parts In-Stock

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$8.351

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700

$8.351

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Corohmni

South Africa . 65 parts In-Stock

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$21.043

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65

$21.043

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Parana Technologies

USA . 298 parts In-Stock

1+ parts

$25.005

100+ parts

-

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$25.696

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298

$25.005

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$25.696

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DigiPath Technology Company

USA . 339 parts In-Stock

1+ parts

$27.534

100+ parts

$25.331

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339

$27.534

$25.331

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ChromeModa Solutions

Germany . 4,008 parts In-Stock

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$28.096

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$23.039

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4,008

$28.096

$23.039

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IDEA Electronic Components Group

UK . 1,953 parts In-Stock

1+ parts

$28.096

100+ parts

$26.691

1k+ parts

$25.286

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1,953

$28.096

$26.691

$25.286

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$39.987

100+ parts

$36.388

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$32.789

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750

$39.987

$36.388

$32.789

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One Stop Electronics

USA . 949 parts In-Stock

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$44.000

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949

$44.000

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Corphita

USA . 2,186 parts In-Stock

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Microchip USA

USA . 1,730 parts In-Stock

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1,730

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Overview

Elevate your electronic designs with the Texas Instruments CDCVF2510PWG4 Clock Driver & Buffer. Crafted with precision and expertise, this high-quality product offers reliability and performance that you can trust. Ideal for a wide range of applications, this clock driver provides seamless synchronization without compromising on speed. With a compact design and advanced features, it ensures efficient operation while maximizing functionality. Experience the value and benefits of superior technology with the CDCVF2510PWG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring a long lifespan.

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures quick signal processing, making this clock driver suitable for high-speed applications.

Input Conditioning: STANDARD

Standard input conditioning makes it compatible with a wide range of signals, enhancing its versatility.

Nominal Supply Voltage / Vsup (V): 3.3

The standard supply voltage of 3.3V makes it easy to integrate this clock driver into existing systems.

Load Capacitance (CL): 25 pF

With a low load capacitance, this clock driver can drive a variety of loads efficiently.

Technical Specifications

Clock Drivers & Buffers CDCVF2510PWG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2510

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

25 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

SERIES-RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Minimum fmax:

175 MHz

Trade Compliance

CDCVF2510PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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