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CDCVF111FNRG4

Texas Instruments

CDCVF111FNRG4 by Texas Instruments

CDCVF111FNRG4 clock driver by Texas Instruments has a propagation delay of 0.6 ns at 3.3V, suitable for industrial applications. With 9 true outputs and a min fmax of 650 MHz, it offers differential input conditioning in a square chip carrier package.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,358 parts In-Stock

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2,358

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Digiode

USA . 2,307 parts In-Stock

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2,307

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Distributors (Availability)

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Andel Nordic

Denmark . 4,482 parts In-Stock

1+ parts

$3.840

100+ parts

-

1k+ parts

$3.686

10k+ parts

$3.686

4,482

$3.840

-

$3.686

$3.686

Native Components

USA . 894 parts In-Stock

1+ parts

$5.570

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-

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894

$5.570

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AZTECH Wire

Italy . 766 parts In-Stock

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$14.244

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766

$14.244

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Parana Technologies

USA . 1,228 parts In-Stock

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$18.492

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$18.605

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1,228

$18.492

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$18.605

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One Stop Electronics

USA . 1,461 parts In-Stock

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$19.000

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1,461

$19.000

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DigiPath Technology Company

USA . 2,217 parts In-Stock

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$20.362

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$18.733

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2,217

$20.362

$18.733

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ChromeModa Solutions

Germany . 5,239 parts In-Stock

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$20.778

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$17.038

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5,239

$20.778

$17.038

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IDEA Electronic Components Group

UK . 953 parts In-Stock

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$20.778

100+ parts

$19.739

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$18.700

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953

$20.778

$19.739

$18.700

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Component Stockers USA

USA . 568 parts In-Stock

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$99.990

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568

$99.990

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Corphita

USA . 4,869 parts In-Stock

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Microchip USA

USA . 1,637 parts In-Stock

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Northwest PG Solutions

USA . 1,291 parts In-Stock

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$5.459

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1,291

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$5.459

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Overview

Unlock the power of precision timing with the CDCVF111FNRG4 by Texas Instruments. As a leader in clock drivers & buffers, Texas Instruments delivers unmatched quality and reliability. This versatile chip carrier offers differential input conditioning and a lightning-fast propagation delay of just 0.6ns. Perfect for industrial applications, this product operates flawlessly in temperatures ranging from -40°C to 85°C. With 28 terminals and 9 true outputs, the CDCVF111FNRG4 provides customers with a high-performance solution that exceeds expectations. Experience seamless synchronization and improved efficiency with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.6 ns

Low propagation delay ensures quick signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient on circuit boards, saving space and simplifying manufacturing processes.

Input Conditioning: DIFFERENTIAL

Differential input conditioning allows for better noise rejection and signal integrity, leading to more reliable performance in various environments.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic systems, making this clock driver compatible with a wide range of applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this clock driver can operate reliably in harsh environmental conditions, making it suitable for industrial applications.

No. of True Outputs: 9

Having 9 true outputs provides flexibility in driving multiple clock signals or distributing timing signals in complex electronic systems.

Minimum fmax: 650 MHz

With a high maximum frequency of 650 MHz, this clock driver can handle high-speed clock signals efficiently, making it ideal for demanding applications.

Technical Specifications

Clock Drivers & Buffers CDCVF111FNRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

111

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e4

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.505 mm

Minimum fmax:

650 MHz

Trade Compliance

CDCVF111FNRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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