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CDCUA877NMKT

Texas Instruments

CDCUA877NMKT by Texas Instruments

Texas Instruments CDCUA877NMKT is a clock driver with 52 terminals, operating at -40 to 85 °C. It features a differential mux input conditioning, 410 MHz min fmax, and 20 true outputs. Ideal for industrial applications requiring precise timing control in compact spaces.

Median Price

$10.520

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 373 parts In-Stock

1+ parts

$8.079

100+ parts

$6.587

1k+ parts

$4.391

10k+ parts

-

373

$8.079

$6.587

$4.391

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$12.960

100+ parts

$8.320

1k+ parts

$6.850

10k+ parts

-

250

$12.960

$8.320

$6.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,287 parts In-Stock

1+ parts

$7.675

100+ parts

-

1k+ parts

-

10k+ parts

-

3,287

$7.675

-

-

-

Vyrian

USA . 5,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,394

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 582 parts In-Stock

1+ parts

$0.466

100+ parts

-

1k+ parts

-

10k+ parts

$0.448

582

$0.466

-

-

$0.448

Northwest PG Solutions

USA . 1,036 parts In-Stock

1+ parts

$0.513

100+ parts

-

1k+ parts

-

10k+ parts

$0.452

1,036

$0.513

-

-

$0.452

Andel Nordic

Denmark . 3,594 parts In-Stock

1+ parts

$5.271

100+ parts

-

1k+ parts

$5.060

10k+ parts

$5.060

3,594

$5.271

-

$5.060

$5.060

Corphita

USA . 2,646 parts In-Stock

1+ parts

$7.271

100+ parts

-

1k+ parts

-

10k+ parts

-

2,646

$7.271

-

-

-

Parana Technologies

USA . 693 parts In-Stock

1+ parts

$22.480

100+ parts

$2,087.574

1k+ parts

$20.232

10k+ parts

-

693

$22.480

$2,087.574

$20.232

-

DigiPath Technology Company

USA . 1,485 parts In-Stock

1+ parts

$24.753

100+ parts

$22.773

1k+ parts

-

10k+ parts

-

1,485

$24.753

$22.773

-

-

ChromeModa Solutions

Germany . 4,098 parts In-Stock

1+ parts

$25.258

100+ parts

$20.712

1k+ parts

-

10k+ parts

-

4,098

$25.258

$20.712

-

-

IDEA Electronic Components Group

UK . 548 parts In-Stock

1+ parts

$25.258

100+ parts

$23.995

1k+ parts

$22.732

10k+ parts

-

548

$25.258

$23.995

$22.732

-

Overview

Experience the exceptional quality and reliability of the Texas Instruments CDCUA877NMKT Clock Drivers & Buffers. With a focus on innovation and cutting-edge technology, Texas Instruments delivers top-notch products that meet the highest industry standards. This versatile component is perfect for a wide range of applications, offering customers unmatched value and performance. Trust Texas Instruments to provide you with superior solutions that will exceed your expectations and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and quick installation on PCBs, saving time and effort.

Input Conditioning: DIFFERENTIAL MUX

The use of a specific input conditioning like differential MUX helps in improving signal quality and reducing noise interference.

Nominal Supply Voltage / Vsup (V): 1.8

The nominal supply voltage of 1.8V is commonly used in low-power applications, making it compatible with a wide range of devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows the driver to disconnect from the output line, enabling a high degree of flexibility in controlling the signal flow.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in cold environments.

Maximum Power Supply Current (ICC): 225 mA

The maximum power supply current of 225mA indicates the capability to drive multiple loads without overheating or performance degradation.

Technical Specifications

Clock Drivers & Buffers CDCUA877NMKT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PBGA-B52

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA52,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

225 mA

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.5 mm

Minimum fmax:

410 MHz

Trade Compliance

CDCUA877NMKT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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