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CDCLVP111VF

Texas Instruments

CDCLVP111VF by Texas Instruments

CDCLVP111VF by Texas Instruments is a clock driver with 0.35 ns propagation delay, 32 terminals, and 10 true outputs. It operates at temperatures from -40 to 85 °C and supports supply voltages of +-2.5/+-3.3 V. Ideal for industrial applications requiring high-speed clock distribution in a compact flatpack package.

Median Price

$8.114

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,964 parts In-Stock

1+ parts

$8.114

100+ parts

$6.615

1k+ parts

$4.410

10k+ parts

-

10,964

$8.114

$6.615

$4.410

-

Mouser Electronics

USA . 175 parts In-Stock

1+ parts

$14.150

100+ parts

$9.080

1k+ parts

$7.690

10k+ parts

-

175

$14.150

$9.080

$7.690

-

Arrow

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.400

10k+ parts

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750

-

-

$6.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,183 parts In-Stock

1+ parts

$7.708

100+ parts

-

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1,183

$7.708

-

-

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TEDSS.com

USA . 6 parts In-Stock

1+ parts

$8.000

100+ parts

-

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6

$8.000

-

-

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Maritex

Poland . 161 parts In-Stock

1+ parts

$9.596

100+ parts

$7.251

1k+ parts

$5.945

10k+ parts

-

161

$9.596

$7.251

$5.945

-

Bristol Electronics

USA . 1,489 parts In-Stock

1+ parts

$10.770

100+ parts

$4.667

1k+ parts

$4.416

10k+ parts

-

1,489

$10.770

$4.667

$4.416

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Vyrian

USA . 5,742 parts In-Stock

1+ parts

-

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5,742

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Dan-Mar Components

USA . 1,429 parts In-Stock

1+ parts

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1,429

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ACDS - Activité Composants Distribution Service

France . 1,250 parts In-Stock

1+ parts

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1,250

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TME

Poland . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.220

10k+ parts

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750

-

-

$8.220

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Prism Electronics

USA . 20 parts In-Stock

1+ parts

-

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20

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Semi Source

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,189 parts In-Stock

1+ parts

$6.332

100+ parts

-

1k+ parts

$6.078

10k+ parts

$6.078

4,189

$6.332

-

$6.078

$6.078

Corphita

USA . 3,174 parts In-Stock

1+ parts

$7.303

100+ parts

-

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3,174

$7.303

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-

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Component Stockers USA

USA . 111 parts In-Stock

1+ parts

$10.210

100+ parts

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111

$10.210

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Parana Technologies

USA . 412 parts In-Stock

1+ parts

$11.658

100+ parts

-

1k+ parts

$12.052

10k+ parts

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412

$11.658

-

$12.052

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ChromeModa Solutions

Germany . 4,358 parts In-Stock

1+ parts

$13.099

100+ parts

$10.741

1k+ parts

-

10k+ parts

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4,358

$13.099

$10.741

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IDEA Electronic Components Group

UK . 927 parts In-Stock

1+ parts

$13.099

100+ parts

$12.444

1k+ parts

$11.789

10k+ parts

-

927

$13.099

$12.444

$11.789

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AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$22.010

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600

$22.010

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Lixinc

USA . 4,962 parts In-Stock

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4,962

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Northwest PG Solutions

USA . 1,190 parts In-Stock

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1,190

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DigiPath Technology Company

USA . 994 parts In-Stock

1+ parts

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100+ parts

$11.810

1k+ parts

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994

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$11.810

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Perfect Parts

USA . 601 parts In-Stock

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601

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Native Components

USA . 368 parts In-Stock

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368

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Overview

Enhance your electronic designs with the CDCLVP111VF by Texas Instruments, a top-quality clock driver and buffer that delivers unrivaled performance. From its durable plastic/epoxy package body material to its differential mux input conditioning, this product offers reliability and precision for your applications. With a nominal supply voltage of 2.5V and maximum power supply current of 85mA, the CDCLVP111VF ensures efficient operation. Trust in Texas Instruments' expertise and elevate your projects with this versatile component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.35 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount design makes installation easier and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, making it compatible with a wide range of systems.

Maximum I (ol): 5 Amp

Capable of handling high output currents, making it suitable for driving multiple loads.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, suitable for industrial applications.

Minimum Supply Voltage (Vsup): 2.375 V

Works reliably even at low supply voltages, ensuring stable operation under various conditions.

Minimum fmax: 3500 MHz

High maximum frequency allows for fast signal processing, ideal for high-performance systems.

Technical Specifications

Clock Drivers & Buffers CDCLVP111VF attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V; ALSO OPERATES AT 3.3 V SUPPLY

Family:

111

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

3500 MHz

Trade Compliance

CDCLVP111VF Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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