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CDCLVP110VFR

Texas Instruments

CDCLVP110VFR by Texas Instruments

CDCLVP110VFR by Texas Instruments is a clock driver with 0.37 ns propagation delay, suitable for industrial applications. It operates at 2.5V nominal voltage and offers 10 true outputs with a max frequency of 3500 MHz. This surface-mount device features differential mux input conditioning and a low profile flatpack package style.

Median Price

$9.351

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,204 parts In-Stock

1+ parts

$9.351

100+ parts

$7.623

1k+ parts

$5.082

10k+ parts

-

4,204

$9.351

$7.623

$5.082

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 243 parts In-Stock

1+ parts

$8.250

100+ parts

$4.950

1k+ parts

$4.744

10k+ parts

-

243

$8.250

$4.950

$4.744

-

Digiode

USA . 347 parts In-Stock

1+ parts

$8.883

100+ parts

-

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347

$8.883

-

-

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Vyrian

USA . 4,764 parts In-Stock

1+ parts

-

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4,764

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Microfarads

USA . 157 parts In-Stock

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157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,140 parts In-Stock

1+ parts

$2.605

100+ parts

-

1k+ parts

$2.501

10k+ parts

$2.501

5,140

$2.605

-

$2.501

$2.501

Corphita

USA . 635 parts In-Stock

1+ parts

$8.416

100+ parts

-

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-

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635

$8.416

-

-

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Parana Technologies

USA . 1,912 parts In-Stock

1+ parts

$9.456

100+ parts

$878.156

1k+ parts

$8.511

10k+ parts

-

1,912

$9.456

$878.156

$8.511

-

DigiPath Technology Company

USA . 1,949 parts In-Stock

1+ parts

$10.412

100+ parts

$9.580

1k+ parts

-

10k+ parts

-

1,949

$10.412

$9.580

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-

AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$10.620

100+ parts

-

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460

$10.620

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ChromeModa Solutions

Germany . 3,270 parts In-Stock

1+ parts

$10.625

100+ parts

$8.712

1k+ parts

-

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3,270

$10.625

$8.712

-

-

IDEA Electronic Components Group

UK . 1,609 parts In-Stock

1+ parts

$10.625

100+ parts

$10.094

1k+ parts

$9.562

10k+ parts

-

1,609

$10.625

$10.094

$9.562

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 6,114 parts In-Stock

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6,114

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Component Stockers USA

USA . 4,181 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,076 parts In-Stock

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4,076

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Lixinc

USA . 1,836 parts In-Stock

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1,836

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Native Components

USA . 978 parts In-Stock

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978

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Northwest PG Solutions

USA . 977 parts In-Stock

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977

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Kepictronics

USA . 972 parts In-Stock

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972

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Overview

Elevate your electronic designs with the Texas Instruments CDCLVP110VFR Clock Drivers & Buffers. Crafted with precision and reliability in mind, this product boasts a superior quality that Texas Instruments is renowned for. From differential MUX input conditioning to a wide range of power supplies, this clock driver offers unparalleled versatility for various applications. With a minimal propagation delay of 0.37 ns and a maximum operating temperature of 85°C, customers can trust in the seamless performance and efficiency of this product. Upgrade your projects today with the CDCLVP110VFR and experience a new level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.37 ns

Ensures fast signal propagation within the clock driver, essential for accurate timing in electronic systems.

Surface Mount: YES

Easily mountable on PCBs, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL MUX

Enhances signal integrity by conditioning input signals, reducing noise and improving overall performance.

Nominal Supply Voltage / Vsup (V): 2.5

Operates efficiently at a common supply voltage, making it compatible with a wide range of electronic devices.

Maximum I (ol): 5 Amp

Capable of driving high current outputs, suitable for demanding applications that require robust performance.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, suitable for industrial applications with elevated heat levels.

Minimum Operating Temperature: -40 °C

Provides operational flexibility in cold environments, ensuring reliable performance across a wide temperature range.

Technical Specifications

Clock Drivers & Buffers CDCLVP110VFR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V; ALSO OPERATES AT 3.3 V SUPPLY

Family:

110

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Maximum Power Supply Current (ICC):

380 mA

Propagation Delay At Nominal Supply:

.37 ns

Propagation Delay (tpd):

.37 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

3500 MHz

Trade Compliance

CDCLVP110VFR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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