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CDC536DL

Texas Instruments

CDC536DL by Texas Instruments

CDC536DL clock driver by Texas Instruments features 28 terminals, 3.3V supply voltage, and 100MHz min fmax. Ideal for applications requiring a small outline package with standard input conditioning and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,343 parts In-Stock

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8,343

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Digiode

USA . 1,376 parts In-Stock

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1,376

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Resion

USA . 84 parts In-Stock

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84

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,801 parts In-Stock

1+ parts

$6.858

100+ parts

-

1k+ parts

$6.583

10k+ parts

$6.583

1,801

$6.858

-

$6.583

$6.583

AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$7.541

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-

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685

$7.541

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Native Components

USA . 213 parts In-Stock

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$9.913

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213

$9.913

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Northwest PG Solutions

USA . 317 parts In-Stock

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$10.904

100+ parts

$9.814

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317

$10.904

$9.814

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Parana Technologies

USA . 2,274 parts In-Stock

1+ parts

$19.913

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$19.865

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2,274

$19.913

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$19.865

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IDEA Electronic Components Group

UK . 1,374 parts In-Stock

1+ parts

$22.374

100+ parts

$21.255

1k+ parts

$20.137

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1,374

$22.374

$21.255

$20.137

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ChromeModa Solutions

Germany . 1,244 parts In-Stock

1+ parts

$22.374

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$18.347

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1,244

$22.374

$18.347

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Advanced Electronics

New Zealand . 81 parts In-Stock

1+ parts

$30.216

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$27.497

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$24.777

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81

$30.216

$27.497

$24.777

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One Stop Electronics

USA . 1,000 parts In-Stock

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$33.000

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1,000

$33.000

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Corphita

USA . 3,381 parts In-Stock

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3,381

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DigiPath Technology Company

USA . 516 parts In-Stock

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$20.172

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516

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$20.172

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Overview

Discover the CDC536DL clock driver by Texas Instruments, a high-quality solution for your timing needs. With a reputation for excellence, Texas Instruments delivers reliable products that are trusted by professionals worldwide. Clock drivers & buffers are essential components for ensuring accurate timing in electronic systems, and the CDC536DL excels in performance and efficiency. Experience seamless integration with its compact package style and standard input conditioning. Enhance your projects with precision and reliability using the CDC536DL from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the clock driver & buffer.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard 3.3V power supplies, ensuring easy integration with existing systems.

Maximum Operating Temperature: 70 °C

Can operate effectively in a wide range of temperature environments.

Technology: BICMOS

Utilizes BiCMOS technology for high performance and low power consumption.

Technical Specifications

Clock Drivers & Buffers CDC536DL attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

536

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G28

Length:

9.525 mm

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

6

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

2.79 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC536DL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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