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CDC509PWRG4

Texas Instruments

CDC509PWRG4 by Texas Instruments

CDC509PWRG4 clock driver by Texas Instruments operates at 3.3V, with load capacitance of 30pF and max fmax of 125MHz. It is ideal for applications requiring precise timing synchronization in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,357 parts In-Stock

1+ parts

-

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4,357

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Digiode

USA . 2,110 parts In-Stock

1+ parts

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2,110

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,921 parts In-Stock

1+ parts

$6.967

100+ parts

-

1k+ parts

$6.688

10k+ parts

$6.688

3,921

$6.967

-

$6.688

$6.688

Parana Technologies

USA . 775 parts In-Stock

1+ parts

$10.901

100+ parts

-

1k+ parts

$11.372

10k+ parts

-

775

$10.901

-

$11.372

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AZTECH Wire

Italy . 481 parts In-Stock

1+ parts

$11.698

100+ parts

-

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481

$11.698

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DigiPath Technology Company

USA . 1,941 parts In-Stock

1+ parts

$12.003

100+ parts

-

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1,941

$12.003

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IDEA Electronic Components Group

UK . 1,595 parts In-Stock

1+ parts

$12.248

100+ parts

$11.636

1k+ parts

$11.023

10k+ parts

-

1,595

$12.248

$11.636

$11.023

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ChromeModa Solutions

Germany . 280 parts In-Stock

1+ parts

$12.248

100+ parts

$10.043

1k+ parts

-

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280

$12.248

$10.043

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One Stop Electronics

USA . 1,084 parts In-Stock

1+ parts

$40.000

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1,084

$40.000

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Native Components

USA . 440 parts In-Stock

1+ parts

$71.213

100+ parts

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$68.364

440

$71.213

-

-

$68.364

Northwest PG Solutions

USA . 185 parts In-Stock

1+ parts

$78.334

100+ parts

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185

$78.334

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Corphita

USA . 3,244 parts In-Stock

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3,244

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Microchip USA

USA . 2,114 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$20.930

1k+ parts

$19.381

10k+ parts

$19.381

300

-

$20.930

$19.381

$19.381

Overview

Enhance your electronic designs with the CDC509PWRG4 by Texas Instruments, a top-tier Clock Driver & Buffer that delivers exceptional performance and reliability. Crafted with precision using high-quality materials, this product guarantees seamless operation and long-lasting durability. Ideal for a wide range of applications, this clock driver offers unmatched value and benefits to customers looking for superior quality components. Trust Texas Instruments to provide you with the best-in-class solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of high-quality plastic/epoxy material ensures durability and reliability, making this product a great choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making it a convenient choice for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Load Capacitance (CL): 30 pF

With a load capacitance of 30 pF, this product can efficiently drive and buffer signals while maintaining signal integrity.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows this product to function reliably in a wide range of environments.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure soldering during the manufacturing process, enhancing reliability.

No. of True Outputs: 9

With 9 true outputs, this product can efficiently drive multiple signals, making it suitable for applications requiring multiple clock signals.

Technical Specifications

Clock Drivers & Buffers CDC509PWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

509

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

9

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

125 MHz

Trade Compliance

CDC509PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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