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CDC536DBRG4

Texas Instruments

CDC536DBRG4 by Texas Instruments

The Texas Instruments CDC536DBRG4 is a Clock Driver & Buffer with 28 terminals, operating at 3.3V. It features a load capacitance of 30pF and supports a max frequency of 100MHz. Ideal for applications requiring precise clock distribution in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,960 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,960

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Semi Source

USA . 1,000 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,000

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Digiode

USA . 137 parts In-Stock

1+ parts

-

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137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,549 parts In-Stock

1+ parts

$4.866

100+ parts

-

1k+ parts

$4.671

10k+ parts

$4.671

2,549

$4.866

-

$4.671

$4.671

Parana Technologies

USA . 480 parts In-Stock

1+ parts

$13.241

100+ parts

-

1k+ parts

$13.745

10k+ parts

-

480

$13.241

-

$13.745

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One Stop Electronics

USA . 1,638 parts In-Stock

1+ parts

$14.000

100+ parts

-

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10k+ parts

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1,638

$14.000

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DigiPath Technology Company

USA . 1,138 parts In-Stock

1+ parts

$14.579

100+ parts

$13.413

1k+ parts

-

10k+ parts

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1,138

$14.579

$13.413

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ChromeModa Solutions

Germany . 3,287 parts In-Stock

1+ parts

$14.877

100+ parts

$12.199

1k+ parts

-

10k+ parts

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3,287

$14.877

$12.199

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IDEA Electronic Components Group

UK . 1,973 parts In-Stock

1+ parts

$14.877

100+ parts

$14.133

1k+ parts

$13.389

10k+ parts

-

1,973

$14.877

$14.133

$13.389

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AZTECH Wire

Italy . 237 parts In-Stock

1+ parts

$18.542

100+ parts

-

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237

$18.542

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Component Stockers USA

USA . 381 parts In-Stock

1+ parts

$99.990

100+ parts

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381

$99.990

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Northwest PG Solutions

USA . 1,500 parts In-Stock

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1,500

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Microchip USA

USA . 1,166 parts In-Stock

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1,166

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Native Components

USA . 996 parts In-Stock

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996

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Corphita

USA . 389 parts In-Stock

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389

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Overview

Transform your electronic designs with the CDC536DBRG4 from Texas Instruments, a leading manufacturer known for top-notch quality and innovation. As part of the Clock Drivers & Buffers category, this product offers high performance and reliability for a wide range of applications. With its small outline package and 3-STATE output characteristics, the CDC536DBRG4 delivers exceptional value and benefits to customers looking for precision timing solutions. Upgrade your projects with ease and confidence using this cutting-edge technology that promises efficiency and seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the clock driver, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and making it suitable for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with a wide range of electronic devices and systems.

Load Capacitance (CL): 30 pF

Optimal load capacitance of 30 pF ensures stable and accurate signal transmission, reducing the risk of signal distortion or interference.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption, making the clock driver efficient and suitable for various applications.

Technical Specifications

Clock Drivers & Buffers CDC536DBRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

536

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

6

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC536DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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