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CDC536DBG4

Texas Instruments

CDC536DBG4 by Texas Instruments

Texas Instruments CDC536DBG4 is a Clock Driver & Buffer with 28 terminals, operating at 3.3V. It offers 6 true outputs, 100MHz fmax, and 30pF load capacitance. Ideal for applications requiring precise clock distribution in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,981 parts In-Stock

1+ parts

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8,981

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Digiode

USA . 3,365 parts In-Stock

1+ parts

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3,365

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 149 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

-

10k+ parts

$0.137

149

$0.142

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-

$0.137

Northwest PG Solutions

USA . 1,120 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

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$0.138

1,120

$0.156

-

-

$0.138

Andel Nordic

Denmark . 1,956 parts In-Stock

1+ parts

$4.653

100+ parts

-

1k+ parts

$4.466

10k+ parts

$4.466

1,956

$4.653

-

$4.466

$4.466

AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$14.188

100+ parts

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215

$14.188

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Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

$18.427

100+ parts

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$18.548

10k+ parts

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2,017

$18.427

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$18.548

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DigiPath Technology Company

USA . 1,020 parts In-Stock

1+ parts

$20.290

100+ parts

$18.667

1k+ parts

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1,020

$20.290

$18.667

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ChromeModa Solutions

Germany . 3,108 parts In-Stock

1+ parts

$20.704

100+ parts

$16.977

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3,108

$20.704

$16.977

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IDEA Electronic Components Group

UK . 1,825 parts In-Stock

1+ parts

$20.704

100+ parts

$19.669

1k+ parts

$18.634

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1,825

$20.704

$19.669

$18.634

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One Stop Electronics

USA . 805 parts In-Stock

1+ parts

$57.000

100+ parts

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805

$57.000

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Corphita

USA . 2,873 parts In-Stock

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2,873

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Microchip USA

USA . 1,064 parts In-Stock

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Overview

Experience precision and reliability with the CDC536DBG4 clock driver by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products designed to meet your needs. Clock drivers are essential components for ensuring smooth operation in various electronic devices, making the CDC536DBG4 a must-have for your projects. With its small outline package and 3-state output characteristics, this clock driver offers unmatched performance and versatility. Trust Texas Instruments to provide you with the best solutions for your applications. Elevate your designs with the CDC536DBG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the product.

Surface Mount: YES

Facilitates easy installation and saves space on the circuit board.

Input Conditioning: STANDARD

Ensures compatibility with a wide range of input signal conditions.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it easy to integrate into existing systems.

Load Capacitance (CL): 30 pF

Can drive a moderate capacitive load without issue.

Power Supplies (V): 3.3

Consistent power supply provided for reliable operation.

Terminal Position: DUAL

Provides flexibility in placement and connection options.

Maximum Operating Temperature: 70 °C

Can withstand relatively high temperatures, suitable for various operating environments.

Output Characteristics: 3-STATE

Allows for high impedance state when output is not required, reducing power consumption.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature conditions.

Width: 5.3 mm

Compact size enables efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during reflow soldering process without damage.

Technology: BICMOS

Combines the benefits of bipolar and CMOS technologies, offering high speed and low power consumption.

Minimum fmax: 100 MHz

Supports high-frequency operation, suitable for demanding clock signal applications.

Maximum Supply Voltage (Vsup): 3.6 V

Provides a safe operating range to prevent damage from overvoltage conditions.

Technical Specifications

Clock Drivers & Buffers CDC536DBG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

536

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

6

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC536DBG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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