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CD74HCT21MT

Texas Instruments

CD74HCT21MT by Texas Instruments

CD74HCT21MT by Texas Instruments is a logic gate with 2 functions and 4 inputs. It has a propagation delay of 41 ns at 5V, making it suitable for high-speed applications. With a small outline package style and surface mount capability, it is ideal for compact electronic designs.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,750 parts In-Stock

1+ parts

$0.280

100+ parts

$0.270

1k+ parts

$0.270

10k+ parts

-

1,750

$0.280

$0.270

$0.270

-

DigiKey

USA . 6 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

$0.389

10k+ parts

$0.361

6

$0.800

-

$0.389

$0.361

Mouser Electronics

USA . 991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.396

10k+ parts

$0.338

991

-

-

$0.396

$0.338

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,129 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

4,129

$0.760

-

-

-

Vyrian

USA . 3,821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,821

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,145 parts In-Stock

1+ parts

$0.720

100+ parts

-

1k+ parts

-

10k+ parts

-

3,145

$0.720

-

-

-

Parana Technologies

USA . 2,188 parts In-Stock

1+ parts

$10.076

100+ parts

-

1k+ parts

$10.628

10k+ parts

-

2,188

$10.076

-

$10.628

-

DigiPath Technology Company

USA . 659 parts In-Stock

1+ parts

$11.095

100+ parts

-

1k+ parts

-

10k+ parts

-

659

$11.095

-

-

-

ChromeModa Solutions

Germany . 826 parts In-Stock

1+ parts

$11.321

100+ parts

$9.283

1k+ parts

-

10k+ parts

-

826

$11.321

$9.283

-

-

IDEA Electronic Components Group

UK . 55 parts In-Stock

1+ parts

$11.321

100+ parts

$10.755

1k+ parts

$10.189

10k+ parts

-

55

$11.321

$10.755

$10.189

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Microchip USA

USA . 8,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,214

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-

-

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A-Z Elektronik GmbH

Germany . 6,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,560

-

-

-

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Alle Elektronik GmbH

Germany . 4,373 parts In-Stock

1+ parts

-

100+ parts

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4,373

-

-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,790

-

-

-

-

Northwest PG Solutions

USA . 1,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.616

10k+ parts

-

1,492

-

-

$4.616

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Perfect Parts

USA . 1,391 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,391

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-

-

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Native Components

USA . 972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.569

10k+ parts

-

972

-

-

$4.569

-

Overview

Elevate your electronic projects with the CD74HCT21MT logic gates from Texas Instruments, a trusted manufacturer known for quality and reliability. This versatile component offers fast propagation delay and low power consumption, making it ideal for a wide range of applications. With dual functions and four inputs, this compact package is designed for efficiency and ease of use. Upgrade your circuits today with the value and performance that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and offers good durability, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 41 ns

Low propagation delay ensures fast operation and high performance of the logic gates.

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the logic gates on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most common electronic systems.

No. of Inputs: 4

Having 4 inputs allows for more complex logic operations to be performed, increasing the versatility of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the logic gates can withstand harsh environmental conditions and maintain reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates CD74HCT21MT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

41 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT21MT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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