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CD74HC4046ANSR96

Texas Instruments

CD74HC4046ANSR96 by Texas Instruments

CD74HC4046ANSR96 by Texas Instruments is a PLL & Frequency Synthesis Circuit with 16 terminals. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a supply voltage range of 2-6 V, it features CMOS technology and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,421 parts In-Stock

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Digiode

USA . 237 parts In-Stock

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237

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Distributors (Availability)

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Native Components

USA . 52 parts In-Stock

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$0.251

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$0.241

52

$0.251

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$0.241

Northwest PG Solutions

USA . 1,663 parts In-Stock

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$0.276

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$0.243

1,663

$0.276

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$0.243

Semicontronic

India . 1,198 parts In-Stock

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$0.500

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$0.488

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$0.485

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1,198

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Ampacity Inc.

Singapore . 249 parts In-Stock

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$0.500

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249

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One Stop Electronics

USA . 1,280 parts In-Stock

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$4.500

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$4.500

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Parana Technologies

USA . 2,290 parts In-Stock

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$12.452

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$12.892

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2,290

$12.452

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$12.892

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DigiPath Technology Company

USA . 2,066 parts In-Stock

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$13.711

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$13.711

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ChromeModa Solutions

Germany . 3,656 parts In-Stock

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$13.991

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$11.473

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$13.991

$11.473

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IDEA Electronic Components Group

UK . 1,696 parts In-Stock

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$13.991

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$13.291

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$12.592

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1,696

$13.991

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$12.592

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AZTECH Wire

Italy . 881 parts In-Stock

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$18.318

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Corphita

USA . 4,242 parts In-Stock

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Corohmni

South Africa . 66 parts In-Stock

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Overview

Enhance your electronic projects with the CD74HC4046ANSR96 by Texas Instruments, a top-quality Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Texas Instruments is renowned for its commitment to excellence, ensuring superior performance and reliability in every product. This versatile device offers precise frequency control and synchronization, making it ideal for applications in telecommunications, data communication, and audio systems. Elevate your designs with the value and benefits this innovative component brings, delivering unmatched quality and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective, ideal for portable or budget-sensitive applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and labor costs.

Nominal Supply Voltage (Vsup): 3 V

Operating at a low nominal supply voltage of 3V helps in reducing power consumption and extending battery life in mobile devices.

Minimum Supply Voltage (Vsup): 2 V

Having a low minimum supply voltage of 2V enables operation in low-power scenarios, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and extended operational periods without overheating.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HC4046ANSR96 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.3 mm

Trade Compliance

CD74HC4046ANSR96 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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