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LMX2330USLEX

Texas Instruments

LMX2330USLEX by Texas Instruments

LMX2330USLEX by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at 3V. It features a BICMOS technology, industrial temperature grade, and nickel/gold terminal finish. This chip carrier has a very thin profile and is suitable for applications requiring precise frequency synthesis in industrial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,451 parts In-Stock

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4,451

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Vyrian

USA . 3,340 parts In-Stock

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3,340

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Anansix

USA . 337 parts In-Stock

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337

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One Stop Electronics

USA . 193 parts In-Stock

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$6.500

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193

$6.500

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AZTECH Wire

Italy . 693 parts In-Stock

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$12.172

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693

$12.172

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Parana Technologies

USA . 1,389 parts In-Stock

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$18.981

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$19.041

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1,389

$18.981

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$19.041

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DigiPath Technology Company

USA . 2,198 parts In-Stock

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$20.900

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$20.900

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ChromeModa Solutions

Germany . 1,571 parts In-Stock

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$21.327

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$17.488

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$21.327

$17.488

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IDEA Electronic Components Group

UK . 605 parts In-Stock

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$21.327

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$20.261

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$19.194

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605

$21.327

$20.261

$19.194

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A-Z Elektronik GmbH

Germany . 6,306 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,204 parts In-Stock

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Corphita

USA . 3,951 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Overview

Unlock unparalleled precision and reliability with the Texas Instruments LMX2330USLEX PLL Frequency Synthesizer. Crafted with cutting-edge BICMOS technology, this chip carrier offers industrial-grade performance in a compact square package. Ideal for a wide range of applications, from telecommunications to aerospace, the LMX2330USLEX ensures seamless frequency synthesis with minimal power consumption. Trust in Texas Instruments' legacy of innovation and quality to elevate your projects to new heights of efficiency and accuracy. Elevate your designs and unleash the full potential of your systems with the LMX2330USLEX today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product a good choice for long-term use at a reasonable price.

Nominal Supply Voltage (Vsup): 3 V

The product operates efficiently at a standard voltage, ensuring compatibility with various systems and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand extreme conditions without compromising its performance.

Technology: BICMOS

The BICMOS technology used in this product combines the advantages of both Bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Maximum Supply Current (Isup): 4.3 mA

The low maximum supply current helps in reducing power consumption, making the product energy-efficient.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2330USLEX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

DUAL MODULUS PRESCALER (RF): 32/33 OR 64/65 AND DUAL MODULUS PRESCALER (IF): 8/9 OR 16/17

Other IC type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4.3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Gold (Ni/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.5 mm

Trade Compliance

LMX2330USLEX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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