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LM565CN

Texas Instruments

LM565CN by Texas Instruments

LM565CN by Texas Instruments is a Phase Locked Loop (PLL) IC with 14 terminals. It operates at supply voltages ranging from -12V to +12V and has a temperature range of 0-70°C. This rectangular package IC is commonly used in frequency synthesis circuits for commercial applications.

Median Price

$18.690

Lifecycle Status

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1k+

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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LWI Electronics Inc

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Huijzer Components

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Bristol Electronics

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Corel Iberica Componentes, S.L.

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MRC Electronics

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Classic Components Corporation

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Atlantic Semiconductor

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Sunrise Surplus Inc.

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Electronic Expediters

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Sinequanon

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Mil-Aero Solutions, Inc.

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Ampacity Inc.

Singapore . 1,431 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

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ChromeModa Solutions

Germany . 798 parts In-Stock

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One Stop Electronics

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AZTECH Wire

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Lixinc

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Authorized Procurement Solutions

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Bastille Electronics

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Montclair Electronics, Inc.

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Overview

Unlock the potential of your electronic projects with the LM565CN by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the field of Phase Locked Loops (PLL) & Frequency Synthesis Circuits. This versatile component offers a wide range of applications, from signal synchronization to frequency modulation. With its compact design and efficient performance, the LM565CN provides unmatched value and benefits for all your circuitry needs. Trust Texas Instruments to elevate your projects to the next level with the LM565CN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Nominal Supply Voltage (Vsup): 6 V

Optimal voltage for efficient operation and performance of the product.

Maximum Operating Temperature: 70 °C

Allows the product to function reliably in a wide range of temperature environments.

Minimum Operating Temperature: 0 °C

Ensures the product can operate effectively even in low temperature conditions.

Width (mm): 7.62 mm

Compact size makes it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 5 V

Provides flexibility in power supply options while maintaining performance.

Maximum Supply Current (Isup): 12.5 mA

Efficient power consumption, suitable for battery-operated devices.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LM565CN attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.18 mm

Maximum Negative Supply Voltage (Vsup):

-12 V

Minimum Negative Supply Voltage (Vsup):

-5 V

Nominal Negative Supply Voltage (Vsup):

-6 V

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

in-line

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

12.5 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

LM565CN Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-005-6567, 5962010056567

NIIN

010056567

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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