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LM565CMWC

Texas Instruments

LM565CMWC by Texas Instruments

PHASE LOCKED LOOP; Temperature Grade: COMMERCIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Terminal Form: NO LEAD;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,442 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,442

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Digiode

USA . 4,308 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,308

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Anansix

USA . 2,612 parts In-Stock

1+ parts

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2,612

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,448 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,448

$3.500

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$18.531

100+ parts

-

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276

$18.531

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Parana Technologies

USA . 510 parts In-Stock

1+ parts

$19.129

100+ parts

$1,776.396

1k+ parts

$17.216

10k+ parts

-

510

$19.129

$1,776.396

$17.216

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DigiPath Technology Company

USA . 1,706 parts In-Stock

1+ parts

$21.063

100+ parts

-

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10k+ parts

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1,706

$21.063

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ChromeModa Solutions

Germany . 3,057 parts In-Stock

1+ parts

$21.493

100+ parts

$17.624

1k+ parts

-

10k+ parts

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3,057

$21.493

$17.624

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IDEA Electronic Components Group

UK . 463 parts In-Stock

1+ parts

$21.493

100+ parts

$20.418

1k+ parts

$19.344

10k+ parts

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463

$21.493

$20.418

$19.344

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Corphita

USA . 2,766 parts In-Stock

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2,766

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Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LM565CMWC attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM565CMWC Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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