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UC1635L/883B

Texas Instruments

UC1635L/883B by Texas Instruments

The Texas Instruments UC1635L/883B is a PLL frequency synthesizer with 20 terminals, operating b/w -55 to 125°C. It features a ceramic, metal-sealed co-fired package suitable for military applications. With a supply voltage range of 8-15V, this chip carrier is ideal for high-reliability systems in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,609 parts In-Stock

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8,609

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Digiode

USA . 4,502 parts In-Stock

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4,502

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Distributors (Availability)

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Semicontronic

India . 715 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

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715

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,469 parts In-Stock

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$2.500

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1,469

$2.500

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Ampacity Inc.

Singapore . 830 parts In-Stock

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$4.500

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830

$4.500

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Parana Technologies

USA . 1,602 parts In-Stock

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$12.048

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$12.456

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1,602

$12.048

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$12.456

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ChromeModa Solutions

Germany . 3,181 parts In-Stock

1+ parts

$13.537

100+ parts

$11.100

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3,181

$13.537

$11.100

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IDEA Electronic Components Group

UK . 729 parts In-Stock

1+ parts

$13.537

100+ parts

$12.860

1k+ parts

$12.183

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729

$13.537

$12.860

$12.183

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AZTECH Wire

Italy . 683 parts In-Stock

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$14.760

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683

$14.760

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Corphita

USA . 957 parts In-Stock

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Corohmni

South Africa . 395 parts In-Stock

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DigiPath Technology Company

USA . 97 parts In-Stock

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$12.205

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97

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$12.205

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Overview

Upgrade your electronics with the UC1635L/883B from Texas Instruments, a top-of-the-line Phase Locked Loops (PLL) & Frequency Synthesis Circuits. Crafted with precision and expertise, this product guarantees reliability and performance. Ideal for military-grade applications, this chip carrier package offers seamless integration and stability. Trust in Texas Instruments to deliver innovative solutions that exceed expectations. Join the ranks of satisfied customers who have experienced the quality and value that the UC1635L/883B brings to their projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and reliability, making this product suitable for harsh environments.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V provides stable power to the circuit, ensuring consistent performance.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can function effectively even in extremely cold conditions.

Technology: BIPOLAR

The bipolar technology used in this product offers high speed and accuracy, making it suitable for precise frequency synthesis applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits UC1635L/883B attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

MOTION CONTROL APPLICATIONS

Other IC type:

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.89 mm

Trade Compliance

UC1635L/883B Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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