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CD74HC4046AMTE4

Texas Instruments

CD74HC4046AMTE4 by Texas Instruments

CD74HC4046AMTE4 by Texas Instruments is a Phase Locked Loop IC with 16 terminals, operating voltage range of 2-6V, and temperature range of -55 to 125°C. It is ideal for frequency synthesis circuits in military-grade applications due to its CMOS technology and compact small outline package design.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Nova Conductors

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One Stop Electronics

USA . 1,138 parts In-Stock

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Ampacity Inc.

Singapore . 858 parts In-Stock

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Parana Technologies

USA . 536 parts In-Stock

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AZTECH Wire

Italy . 626 parts In-Stock

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DigiPath Technology Company

USA . 437 parts In-Stock

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ChromeModa Solutions

Germany . 4,770 parts In-Stock

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IDEA Electronic Components Group

UK . 1,123 parts In-Stock

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Corohmni

South Africa . 200 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Overview

Unlock a world of precision and reliability with the Texas Instruments CD74HC4046AMTE4, a top-of-the-line Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Crafted with superior quality and expertise by Texas Instruments, this innovative product offers unmatched performance and versatility. Perfect for applications requiring accurate frequency generation and synchronization, the CD74HC4046AMTE4 guarantees optimal results every time. Experience enhanced efficiency and seamless operation with this cutting-edge solution that delivers exceptional value and benefits to customers seeking top-notch electronic components. Trust Texas Instruments for excellence in technology and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the PLL and frequency synthesis circuit, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3 V

Operates efficiently at a common voltage level, making it compatible with various power sources.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for use in demanding environments.

Temperature Grade: MILITARY

Meets strict military standards for performance and reliability, ensuring robust operation in rugged conditions.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HC4046AMTE4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CD74HC4046AMTE4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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