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LMX2522LQX1635

Texas Instruments

LMX2522LQX1635 by Texas Instruments

LMX2522LQX1635 by Texas Instruments is a PLL frequency synthesizer with 28 terminals, operating voltage of 2.7-3.3V, and package style of chip carrier. It has a max supply current of 21mA and operates in temperatures ranging from -30 to 85°C. Ideal for applications requiring precise frequency synthesis in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,725 parts In-Stock

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7,725

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Anansix

USA . 2,157 parts In-Stock

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2,157

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Digiode

USA . 1,667 parts In-Stock

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1,667

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 136 parts In-Stock

1+ parts

$5.500

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136

$5.500

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One Stop Electronics

USA . 1,087 parts In-Stock

1+ parts

$6.500

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1,087

$6.500

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AZTECH Wire

Italy . 826 parts In-Stock

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$8.031

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826

$8.031

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Parana Technologies

USA . 300 parts In-Stock

1+ parts

$13.378

100+ parts

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$13.896

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300

$13.378

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$13.896

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DigiPath Technology Company

USA . 1,247 parts In-Stock

1+ parts

$14.730

100+ parts

$13.552

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1,247

$14.730

$13.552

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ChromeModa Solutions

Germany . 2,369 parts In-Stock

1+ parts

$15.031

100+ parts

$12.325

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2,369

$15.031

$12.325

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IDEA Electronic Components Group

UK . 780 parts In-Stock

1+ parts

$15.031

100+ parts

$14.279

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$13.528

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780

$15.031

$14.279

$13.528

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Corphita

USA . 4,564 parts In-Stock

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4,564

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Overview

Unlock the power of precision frequency synthesis with the LMX2522LQX1635 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in every product. The LMX2522LQX1635 falls under the Phase Locked Loops (PLL) & Frequency Synthesis Circuits category, offering seamless integration and superior performance. With a nominal supply voltage of 2.8V, this surface-mountable chip carrier is perfect for a wide range of applications. Experience unparalleled value and efficiency with the LMX2522LQX1635, providing customers with unmatched benefits and advantages in their projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and quick mounting on PCBs, reducing assembly time and costs.

Nominal Supply Voltage (Vsup): 2.8 V

Optimal supply voltage ensures stable and reliable performance of the PLL & frequency synthesis circuit.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without performance degradation, increasing versatility of applications.

Minimum Operating Temperature: -30 °C

Can operate in low temperature environments as well, making it suitable for a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn85Pb15)

Tin/Lead terminal finish provides good solderability and conductivity for reliable connections.

Width (mm): 5 mm

Compact size allows for space-saving in designs and efficient use of PCB real estate.

Minimum Supply Voltage (Vsup): 2.7 V

Can operate at lower supply voltage if needed, providing flexibility in power requirements.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand reflow soldering process for up to 40 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering process without damage to the components.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density mounting on PCBs, enabling more components in a limited space.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture, ensuring reliability during storage and handling.

Maximum Supply Voltage (Vsup): 3.3 V

Can handle higher supply voltage if required, providing flexibility in power input options.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2522LQX1635 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

21 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5 mm

Trade Compliance

LMX2522LQX1635 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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