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LMX2531LQX1500E

Texas Instruments

LMX2531LQX1500E by Texas Instruments

LMX2531LQX1500E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating voltage of 2.8-3.2V, and temperature range of -40 to 85°C. It features BICMOS technology, matte tin finish, and square package shape suitable for industrial applications requiring precise frequency synthesis.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,263 parts In-Stock

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5,263

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Digiode

USA . 4,339 parts In-Stock

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Anansix

USA . 2,532 parts In-Stock

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2,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$5.429

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-

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877

$5.429

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One Stop Electronics

USA . 1,084 parts In-Stock

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$5.500

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1,084

$5.500

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Parana Technologies

USA . 1,973 parts In-Stock

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$16.121

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$16.449

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1,973

$16.121

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$16.449

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DigiPath Technology Company

USA . 21 parts In-Stock

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$17.752

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$16.332

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21

$17.752

$16.332

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ChromeModa Solutions

Germany . 1,742 parts In-Stock

1+ parts

$18.114

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$14.853

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1,742

$18.114

$14.853

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IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$18.114

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$17.208

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$16.303

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400

$18.114

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$16.303

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Corphita

USA . 1,865 parts In-Stock

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Overview

Unlock a world of precise frequency synthesis with the LMX2531LQX1500E by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in their Phase Locked Loops products. Ideal for a wide range of applications, this PLL Frequency Synthesizer offers customers exceptional value with its surface mount capability, industrial temperature grade, and innovative BICMOS technology. Say goodbye to compromises and hello to top-notch performance with the LMX2531LQX1500E.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient assembly onto circuit boards, saving time and resources during production.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3 V ensures compatibility with a wide range of electronic systems and power sources.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style of chip carrier, heat sink/slug, and very thin profile makes this product suitable for compact and space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product offers reliable performance even in high-temperature environments.

Technology: BICMOS

Utilizing BiCMOS technology, this product combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQX1500E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.2 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

6 mm

Trade Compliance

LMX2531LQX1500E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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