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CD74HC109MG4

Texas Instruments

CD74HC109MG4 by Texas Instruments

CD74HC109MG4 by Texas Instruments is a dual-function latches & flip-flops IC with 53ns propagation delay at 4.5V. It operates b/w -55 to 125°C, has a max frequency of 20MHz, and uses CMOS technology. Ideal for military-grade applications requiring positive edge triggering in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,370 parts In-Stock

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Vyrian

USA . 2,056 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 588 parts In-Stock

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$16.647

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Parana Technologies

USA . 2,167 parts In-Stock

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$25.193

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$25.837

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DigiPath Technology Company

USA . 2,284 parts In-Stock

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$27.741

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ChromeModa Solutions

Germany . 3,073 parts In-Stock

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$28.307

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$23.212

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IDEA Electronic Components Group

UK . 2,249 parts In-Stock

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$28.307

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$26.892

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$25.476

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One Stop Electronics

USA . 156 parts In-Stock

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$34.000

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Component Stockers USA

USA . 271 parts In-Stock

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$99.990

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Microchip USA

USA . 4,208 parts In-Stock

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Corphita

USA . 1,586 parts In-Stock

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Northwest PG Solutions

USA . 1,327 parts In-Stock

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Native Components

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Overview

Experience top-notch quality and reliability with the CD74HC109MG4 by Texas Instruments, a leading manufacturer in the industry. This versatile latches & flip-flops category product offers unmatched value and benefits to customers. Its high performance and wide range of applications make it an essential component for any project. Trust in Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Choose the CD74HC109MG4 for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the latch, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 53 ns

A fast propagation delay allows for quick switching between states, making this latch suitable for applications requiring high-speed data processing.

Surface Mount: YES

Being surface mountable, this latch can be easily integrated into modern PCB layouts, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V allows for compatibility with a wide range of systems, making this latch versatile for various applications.

No. of Terminals: 16

With 16 terminals, this latch offers multiple connection points for input and output signals, enabling complex logic operations to be implemented.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures that the latch responds to changes in input signals at the rising edge, providing precise control over the switching behavior.

Technology: CMOS

The CMOS technology used in this latch ensures low power consumption and high noise immunity, making it suitable for battery-powered devices and noisy environments.

Technical Specifications

Latches & Flip-Flops CD74HC109MG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC109MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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