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CD74HC00EE4

Texas Instruments

CD74HC00EE4 by Texas Instruments

CD74HC00EE4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 27 ns at 4.5V, making it suitable for high-speed applications. With a MILITARY temperature grade and through-hole terminal form, it is ideal for rugged environments requiring fast signal processing.

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,054 parts In-Stock

1+ parts

$1.710

100+ parts

$0.662

1k+ parts

$0.409

10k+ parts

$0.341

2,054

$1.710

$0.662

$0.409

$0.341

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.337

100+ parts

-

1k+ parts

-

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-

200

$0.337

-

-

-

Digiode

USA . 2,001 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

-

2,001

$0.750

-

-

-

Vyrian

USA . 4,596 parts In-Stock

1+ parts

-

100+ parts

-

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4,596

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

$0.317

10k+ parts

-

100

$0.330

-

$0.317

-

Ampacity Inc.

Singapore . 451 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

-

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-

451

$0.670

-

-

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Corphita

USA . 3,302 parts In-Stock

1+ parts

$0.711

100+ parts

-

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3,302

$0.711

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-

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Parana Technologies

USA . 1,910 parts In-Stock

1+ parts

$16.372

100+ parts

-

1k+ parts

$16.670

10k+ parts

-

1,910

$16.372

-

$16.670

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AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$16.615

100+ parts

-

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499

$16.615

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DigiPath Technology Company

USA . 209 parts In-Stock

1+ parts

$18.027

100+ parts

$16.585

1k+ parts

-

10k+ parts

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209

$18.027

$16.585

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ChromeModa Solutions

Germany . 6,604 parts In-Stock

1+ parts

$18.395

100+ parts

$15.084

1k+ parts

-

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6,604

$18.395

$15.084

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IDEA Electronic Components Group

UK . 1,286 parts In-Stock

1+ parts

$18.395

100+ parts

$17.475

1k+ parts

$16.556

10k+ parts

-

1,286

$18.395

$17.475

$16.556

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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3,790

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Perfect Parts

USA . 780 parts In-Stock

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780

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Overview

Get ready to experience top-tier quality and reliability with the Texas Instruments CD74HC00EE4 Logic Gates. As a trusted manufacturer in the industry, Texas Instruments delivers cutting-edge technology that surpasses expectations. The CD74HC00EE4 is ideal for a wide range of applications, offering customers unmatched value and benefits. This product provides fast propagation delay, low power consumption, and a wide operating temperature range, making it a versatile and dependable choice for your logic gate needs. Trust Texas Instruments to bring innovation and excellence to your projects with the CD74HC00EE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 27 ns

The fast propagation delay at nominal supply voltage allows for quick signal processing, making this product suitable for time-sensitive applications.

No. of Functions: 4

With 4 functions in one package, this product offers high functionality and versatility in logic operations.

No. of Inputs: 2

Having 2 inputs allows for flexibility in input configurations and logic operations.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides stable power input for reliable operation of the logic gates.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures efficient signal transmission and minimal signal loss.

Power Supplies (V): 2/6

Support for power supplies ranging from 2V to 6V allows for versatile compatibility with different systems and applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes this product suitable for use in various harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable performance even in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable in operation.

Technical Specifications

Logic Gates CD74HC00EE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HC00EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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