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CD74AC374ME4

Texas Instruments

CD74AC374ME4 by Texas Instruments

CD74AC374ME4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 15.1 ns, operating at a max frequency of 89 MHz. It features a small outline package and is suitable for applications requiring independent control and positive edge triggering in military-grade environments.

Median Price

$1.180

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 789 parts In-Stock

1+ parts

$1.180

100+ parts

$0.829

1k+ parts

$0.540

10k+ parts

$0.461

789

$1.180

$0.829

$0.540

$0.461

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,071 parts In-Stock

1+ parts

$1.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$1.121

-

-

-

Vyrian

USA . 8,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,584

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,039 parts In-Stock

1+ parts

$1.062

100+ parts

-

1k+ parts

-

10k+ parts

-

2,039

$1.062

-

-

-

Andel Nordic

Denmark . 2,632 parts In-Stock

1+ parts

$7.073

100+ parts

-

1k+ parts

$6.790

10k+ parts

$6.790

2,632

$7.073

-

$6.790

$6.790

Parana Technologies

USA . 1,209 parts In-Stock

1+ parts

$11.638

100+ parts

-

1k+ parts

$12.032

10k+ parts

-

1,209

$11.638

-

$12.032

-

DigiPath Technology Company

USA . 1,220 parts In-Stock

1+ parts

$12.814

100+ parts

$11.789

1k+ parts

-

10k+ parts

-

1,220

$12.814

$11.789

-

-

IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$13.076

100+ parts

$12.422

1k+ parts

$11.768

10k+ parts

-

1,720

$13.076

$12.422

$11.768

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ChromeModa Solutions

Germany . 188 parts In-Stock

1+ parts

$13.076

100+ parts

$10.722

1k+ parts

-

10k+ parts

-

188

$13.076

$10.722

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-

Perfect Parts

USA . 1,036 parts In-Stock

1+ parts

-

100+ parts

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1,036

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Northwest PG Solutions

USA . 570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.464

10k+ parts

-

570

-

-

$3.464

-

Native Components

USA . 408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.429

10k+ parts

-

408

-

-

$3.429

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD74AC374ME4 bus driver & transceiver. Perfect for a wide range of applications, this product offers customers exceptional value and performance. With a compact design and advanced technology, this 8-bit device provides fast propagation delay at nominal supply, ensuring efficient operation. Trust in Texas Instruments for all your electronic component needs, and discover the advantages of the CD74AC374ME4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 15.1 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact electronic designs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic systems, providing compatibility and ease of integration.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate operation, providing flexibility in controlling the signal output and reducing power consumption when not in use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in digital signal processing.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure stable performance in various applications.

Technical Specifications

Bus Driver & Transceivers CD74AC374ME4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

89000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

15.1 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CD74AC374ME4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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