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CC2650F128RSMT

Texas Instruments

CC2650F128RSMT by Texas Instruments

The Texas Instruments CC2650F128RSMT is a 16-bit microcontroller with Cortex-M3 CPU, offering 131072 ROM words and 28 RAM words. It features 8 ADC channels, 32 DMA channels, and peripherals like RTC and timers. Ideal for industrial applications requiring low power consumption and connectivity via I2C, I2S, SPI, and UART interfaces.

Median Price

$7.284

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 245 parts In-Stock

1+ parts

$5.400

100+ parts

$3.700

1k+ parts

$3.560

10k+ parts

-

245

$5.400

$3.700

$3.560

-

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$5.480

100+ parts

$4.467

1k+ parts

$2.978

10k+ parts

-

1,500

$5.480

$4.467

$2.978

-

Verical

USA . 620 parts In-Stock

1+ parts

$6.979

100+ parts

$4.804

1k+ parts

$4.061

10k+ parts

$3.778

620

$6.979

$4.804

$4.061

$3.778

DigiKey

USA . 604 parts In-Stock

1+ parts

$7.590

100+ parts

$5.747

1k+ parts

$5.140

10k+ parts

$4.915

604

$7.590

$5.747

$5.140

$4.915

Mouser Electronics

USA . 97 parts In-Stock

1+ parts

$7.590

100+ parts

$5.740

1k+ parts

$4.630

10k+ parts

-

97

$7.590

$5.740

$4.630

-

Chip1Stop

Japan . 620 parts In-Stock

1+ parts

$8.160

100+ parts

$6.130

1k+ parts

$5.050

10k+ parts

$4.490

620

$8.160

$6.130

$5.050

$4.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,157 parts In-Stock

1+ parts

$5.206

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$5.206

-

-

-

Vyrian

USA . 6,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,197

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 122 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

-

10k+ parts

-

122

$1.570

-

-

-

Northwest PG Solutions

USA . 2,183 parts In-Stock

1+ parts

$1.727

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$1.727

-

-

-

Ampacity Inc.

Singapore . 281 parts In-Stock

1+ parts

$4.660

100+ parts

-

1k+ parts

-

10k+ parts

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281

$4.660

-

-

-

Corphita

USA . 4,443 parts In-Stock

1+ parts

$4.932

100+ parts

-

1k+ parts

-

10k+ parts

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4,443

$4.932

-

-

-

Parana Technologies

USA . 1,747 parts In-Stock

1+ parts

$36.235

100+ parts

-

1k+ parts

-

10k+ parts

-

1,747

$36.235

-

-

-

DigiPath Technology Company

USA . 91 parts In-Stock

1+ parts

$39.899

100+ parts

-

1k+ parts

-

10k+ parts

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91

$39.899

-

-

-

ChromeModa Solutions

Germany . 3,675 parts In-Stock

1+ parts

$40.713

100+ parts

$33.385

1k+ parts

-

10k+ parts

-

3,675

$40.713

$33.385

-

-

IDEA Electronic Components Group

UK . 725 parts In-Stock

1+ parts

$40.713

100+ parts

$38.677

1k+ parts

$36.642

10k+ parts

-

725

$40.713

$38.677

$36.642

-

GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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560

-

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Overview

Upgrade your projects with the CC2650F128RSMT microcontroller from Texas Instruments, a leader in innovative technology solutions. Designed for a wide range of applications, this powerful microcontroller features integrated cache, high-quality construction, and a compact package body material. With low power mode capabilities and a variety of connectivity options, the CC2650F128RSMT offers unmatched value and performance for your next project. Trust Texas Instruments for reliable, cutting-edge solutions that push the boundaries of what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material makes the microcontroller lightweight and durable.

Integrated Cache: YES

Having an integrated cache helps in improving overall system performance by reducing access time to frequently used data.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage within the microcontroller.

Bit Size: 16

The 16-bit architecture provides enhanced computational capabilities compared to lower bit sizes.

No. of Terminals: 32

Having a larger number of terminals allows for more connectivity options and integration with external devices.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables power-efficient operation and potential use in battery-powered applications.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures high performance and reliability in microcontroller operations.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller uses RISC architecture for efficient and streamlined data processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Technical Specifications

Microcontrollers CC2650F128RSMT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CORTEX-M3

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

20480

RAM Words:

28

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SPI, UART

Peripherals:

DMA(32), RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CC2650F128RSMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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