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CC2650F128RHBT

Texas Instruments

CC2650F128RHBT by Texas Instruments

The Texas Instruments CC2650F128RHBT is a microcontroller with Cortex-M3 CPU, 131072 ROM words, and 8 ADC channels. It operates b/w -40 to 85 °C and features DMA(32), RTC, TIMER(4), WDT peripherals. Ideal for industrial applications requiring low power consumption and high-speed connectivity via I2C, I2S, SPI, UART interfaces.

Median Price

$8.080

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 53,940 parts In-Stock

1+ parts

$5.332

100+ parts

$4.347

1k+ parts

$2.898

10k+ parts

-

53,940

$5.332

$4.347

$2.898

-

DigiKey

USA . 2,609 parts In-Stock

1+ parts

$8.080

100+ parts

$6.125

1k+ parts

-

10k+ parts

-

2,609

$8.080

$6.125

-

-

Mouser Electronics

USA . 459 parts In-Stock

1+ parts

$8.080

100+ parts

$5.390

1k+ parts

$4.830

10k+ parts

-

459

$8.080

$5.390

$4.830

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.299

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.299

-

-

-

Digiode

USA . 3,122 parts In-Stock

1+ parts

$4.693

100+ parts

-

1k+ parts

-

10k+ parts

-

3,122

$4.693

-

-

-

Vyrian

USA . 18,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,631

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 18,886 parts In-Stock

1+ parts

$3.080

100+ parts

-

1k+ parts

-

10k+ parts

-

18,886

$3.080

-

-

-

Semicontronic

India . 18,682 parts In-Stock

1+ parts

$4.200

100+ parts

$4.095

1k+ parts

$4.074

10k+ parts

-

18,682

$4.200

$4.095

$4.074

-

Continental Prestige Electronics

USA . 6,118 parts In-Stock

1+ parts

$4.299

100+ parts

-

1k+ parts

-

10k+ parts

$4.213

6,118

$4.299

-

-

$4.213

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.299

100+ parts

-

1k+ parts

$4.084

10k+ parts

$3.998

1,000

$4.299

-

$4.084

$3.998

Argo Parts USA

USA . 636 parts In-Stock

1+ parts

$4.299

100+ parts

-

1k+ parts

-

10k+ parts

-

636

$4.299

-

-

-

Corohmni

South Africa . 493 parts In-Stock

1+ parts

$4.400

100+ parts

-

1k+ parts

-

10k+ parts

-

493

$4.400

-

-

-

Corphita

USA . 1,446 parts In-Stock

1+ parts

$4.446

100+ parts

-

1k+ parts

-

10k+ parts

-

1,446

$4.446

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$52.750

100+ parts

$48.003

1k+ parts

$43.255

10k+ parts

-

1,000

$52.750

$48.003

$43.255

-

Parana Technologies

USA . 1,238 parts In-Stock

1+ parts

$70.860

100+ parts

-

1k+ parts

-

10k+ parts

-

1,238

$70.860

-

-

-

DigiPath Technology Company

USA . 2,131 parts In-Stock

1+ parts

$78.026

100+ parts

-

1k+ parts

-

10k+ parts

-

2,131

$78.026

-

-

-

ChromeModa Solutions

Germany . 4,729 parts In-Stock

1+ parts

$79.618

100+ parts

$65.287

1k+ parts

-

10k+ parts

-

4,729

$79.618

$65.287

-

-

IDEA Electronic Components Group

UK . 1,636 parts In-Stock

1+ parts

$79.618

100+ parts

$75.637

1k+ parts

$71.656

10k+ parts

-

1,636

$79.618

$75.637

$71.656

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

Overview

Unlock the full potential of your projects with the Texas Instruments CC2650F128RHBT microcontroller. Crafted with precision and expertise, this powerful device offers a wide range of applications in various industries. From its integrated cache to its low power mode, the CC2650F128RHBT delivers unparalleled value and performance. Trust in Texas Instruments to provide you with cutting-edge technology that exceeds your expectations. Elevate your designs with the CC2650F128RHBT and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external factors, ensuring long-term reliability.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 3.8 V

Allows for a wide range of power supply options for flexibility in different applications.

Package Shape: SQUARE

Optimal form factor for easy mounting and integration into various electronic devices.

No. of Terminals: 32

Offers sufficient connectivity options for interfacing with external components and peripherals.

CPU Family: CORTEX-M3

Part of a well-established and highly efficient processor family known for its performance and energy efficiency.

ADC Channels: YES

Enables analog to digital conversion for accurate sensing and data acquisition capabilities.

DMA Channels: YES

Enhances data transfer speed and efficiency by offloading data movement tasks from the CPU.

ROM Words: 131072

Ample read-only memory for storing program instructions and data, allowing for complex applications to be supported.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing and control of external peripherals, ideal for embedded systems.

PWM Channels: YES

Facilitates precise control of analog components such as motors, LEDs, and servos for various applications.

Technical Specifications

Microcontrollers CC2650F128RHBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CORTEX-M3

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

15

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

20480

RAM Words:

28

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SPI, UART

Peripherals:

DMA(32), RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CC2650F128RHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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