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CC2652P74T0RGZR

Texas Instruments

CC2652P74T0RGZR by Texas Instruments

CC2652P74T0RGZR by Texas Instruments is a 32-bit microcontroller with integrated cache and surface mount capability. It has a max clock frequency of 48 MHz and offers connectivity options such as I2C, I2S, SSI, and UART. This microcontroller is suitable for applications requiring low power mode and features like ADC channels, DMA channels, and PWM channels.

Median Price

$8.520

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Texas Instruments

USA . 12,272 parts In-Stock

1+ parts

$4.416

100+ parts

$3.600

1k+ parts

$2.400

10k+ parts

-

12,272

$4.416

$3.600

$2.400

-

Mouser Electronics

USA . 5,926 parts In-Stock

1+ parts

$8.520

100+ parts

$5.400

1k+ parts

$4.150

10k+ parts

$4.030

5,926

$8.520

$5.400

$4.150

$4.030

DigiKey

USA . 1,720 parts In-Stock

1+ parts

$8.520

100+ parts

$5.598

1k+ parts

$5.416

10k+ parts

$4.199

1,720

$8.520

$5.598

$5.416

$4.199

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Digiode

USA . 2,575 parts In-Stock

1+ parts

$4.195

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-

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2,575

$4.195

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Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$5.735

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24

$5.735

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Vyrian

USA . 6,313 parts In-Stock

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6,313

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,611 parts In-Stock

1+ parts

$3.750

100+ parts

-

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-

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6,611

$3.750

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Semicontronic

India . 6,217 parts In-Stock

1+ parts

$3.750

100+ parts

$3.656

1k+ parts

$3.638

10k+ parts

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6,217

$3.750

$3.656

$3.638

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Corphita

USA . 1,755 parts In-Stock

1+ parts

$3.974

100+ parts

-

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1,755

$3.974

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Continental Prestige Electronics

USA . 5,599 parts In-Stock

1+ parts

$5.735

100+ parts

-

1k+ parts

-

10k+ parts

$5.620

5,599

$5.735

-

-

$5.620

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.735

100+ parts

$5.620

1k+ parts

-

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1,000

$5.735

$5.620

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-

Parana Technologies

USA . 1,498 parts In-Stock

1+ parts

$53.457

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1,498

$53.457

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DigiPath Technology Company

USA . 341 parts In-Stock

1+ parts

$58.863

100+ parts

$54.154

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341

$58.863

$54.154

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ChromeModa Solutions

Germany . 1,548 parts In-Stock

1+ parts

$60.064

100+ parts

$49.252

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1,548

$60.064

$49.252

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IDEA Electronic Components Group

UK . 782 parts In-Stock

1+ parts

$60.064

100+ parts

$57.061

1k+ parts

$54.058

10k+ parts

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782

$60.064

$57.061

$54.058

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Corohmni

South Africa . 698 parts In-Stock

1+ parts

$66.603

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698

$66.603

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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Argo Parts USA

USA . 2,870 parts In-Stock

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2,870

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Overview

Experience the power of innovation with the CC2652P74T0RGZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and performance. This microcontroller offers a wide range of applications, making it perfect for various projects. With its integrated cache and advanced technology, this product ensures fast and efficient processing. The CC2652P74T0RGZR also boasts low power mode, maximizing energy efficiency. Whether you're working on IoT devices or smart home systems, this microcontroller is the ultimate solution. Discover the value and benefits it brings to your projects today!

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the microcontroller by reducing memory access times.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making it suitable for mass production.

Maximum Supply Voltage: 3.8 V

This higher maximum supply voltage provides flexibility in power supply design and compatibility with a wide range of components.

On Chip Data RAM Width: 8

With a wide data RAM width, the microcontroller can handle larger chunks of data more efficiently.

Package Shape: SQUARE

The square package shape offers good thermal dissipation and ease of placement on a PCB layout.

Bit Size: 32

Being a 32-bit microcontroller, it can handle larger data sets and perform complex calculations efficiently.

DAC Channels: YES

The presence of DAC channels allows for analog output generation, making it suitable for applications requiring analog signaling.

No. of Terminals: 48

Having a high number of terminals provides ample interfacing options for connecting to external devices and peripherals.

Minimum Supply Voltage: 1.8 V

The lower minimum supply voltage helps in reducing power consumption and extending battery life in portable applications.

CPU Family: CORTEX-M4F

Belonging to the Cortex-M4F family, this microcontroller offers high performance and floating-point processing capabilities.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, the microcontroller can be used in harsh environments and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish enhances the durability and reliability of the connections, ensuring long-term performance.

ADC Channels: YES

The availability of ADC channels enables the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

Having DMA channels allows for efficient data handling and offloading the CPU for more complex tasks, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position offers a balanced layout for easy PCB design and efficient signal routing.

ROM Words: 720896

With a large ROM capacity, the microcontroller can store a significant amount of program code and data.

Digital To Analog Convertors: 1-Ch 8-Bit

The DAC with 8-bit resolution allows for precise analog output control in applications such as audio processing or sensor interfacing.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the PCB during manufacturing or maintenance, improving overall reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and power efficiency, making it suitable for various embedded applications.

No. of Timers: 4

Multiple timers provide precise timing control for various tasks such as event scheduling, signal generation, and PWM output.

RAM Bytes: 155648

With a large RAM capacity, the microcontroller can efficiently handle temporary data storage and buffer requirements for complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form factor simplifies the manufacturing process and ensures reliable solder connections.

Analog To Digital Convertors: 8-Ch 12-Bit

Having multiple ADC channels with 12-bit resolution enables accurate and high-resolution analog signal conversion for precise measurements.

Maximum Supply Current: 3.1 mA

The low supply current consumption helps in minimizing power usage and extending battery life in energy-efficient applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage provides stable operation and compatibility with standard power sources, ensuring reliable performance.

No. of DMA Channels: 32

With a high number of DMA channels, the microcontroller can efficiently manage data transfers and optimize system performance.

No. of Serial I/Os: 2

Having multiple serial I/O interfaces enables versatile communication options with external devices, sensors, and networking modules.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog outputs such as motor speed, LED brightness, and power management.

Connectivity: I2C, I2S, SSI(2), UART(2)

Support for multiple communication protocols enhances the connectivity options for interfacing with a wide range of peripherals and devices.

ROM Programmability: FLASH

Flash programmability offers flexibility in updating firmware and program code, enabling over-the-air updates and customization in the field.

Format: FLOATING-POINT

Support for floating-point format facilitates efficient mathematical calculations and algorithm implementation, suitable for high-precision applications.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the moisture sensitivity of the microcontroller, ensuring proper handling and storage to prevent damage during manufacturing.

Speed: 48 rpm

With a clock frequency of 48 MHz, the microcontroller offers high-speed performance for real-time processing tasks and data throughput.

Low Power Mode: YES

Support for low power modes enables energy-efficient operation and extended battery life in standby or idle states.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows for efficient storage and execution of program instructions, enhancing system performance.

No. of I/O Lines: 26

Having a sufficient number of I/O lines provides flexibility for interfacing with external devices, sensors, and peripherals, enabling versatile applications.

Technical Specifications

Microcontrollers CC2652P74T0RGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

26

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Shape:

Peak Reflow Temperature (C):

260

RAM Bytes:

155648

ROM Words:

720896

ROM Programmability:

FLASH

Speed:

48 rpm

Maximum Supply Current:

3.1 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SSI(2), UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

CC2652P74T0RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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