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CC2650F128RHBR

Texas Instruments

CC2650F128RHBR by Texas Instruments

Texas Instruments CC2650F128RHBR is a 16-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 20480 RAM bytes. Featuring 8 ADC channels, it offers connectivity via I2C, I2S, SPI, and UART for industrial applications requiring low power mode and PWM channels. With a temperature range of -40 to 85 °C, this chip carrier package supports boundary scan and DMA peripherals.

Median Price

$6.290

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,748 parts In-Stock

1+ parts

$3.809

100+ parts

$3.105

1k+ parts

$2.070

10k+ parts

-

10,748

$3.809

$3.105

$2.070

-

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$6.290

100+ parts

$4.754

1k+ parts

$4.182

10k+ parts

$3.947

3,000

$6.290

$4.754

$4.182

$3.947

Mouser Electronics

USA . 3,661 parts In-Stock

1+ parts

$6.820

100+ parts

$4.400

1k+ parts

$4.010

10k+ parts

$3.950

3,661

$6.820

$4.400

$4.010

$3.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.180

100+ parts

-

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-

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50

$3.180

-

-

-

Digiode

USA . 69 parts In-Stock

1+ parts

$3.619

100+ parts

-

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-

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69

$3.619

-

-

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Vyrian

USA . 6,368 parts In-Stock

1+ parts

-

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-

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6,368

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Cyclops Electronics Ltd

UK . 5,000 parts In-Stock

1+ parts

-

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5,000

-

-

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,473 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

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6,473

$2.450

-

-

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Argo Parts USA

USA . 3,286 parts In-Stock

1+ parts

$3.180

100+ parts

-

1k+ parts

-

10k+ parts

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3,286

$3.180

-

-

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Continental Prestige Electronics

USA . 2,535 parts In-Stock

1+ parts

$3.180

100+ parts

-

1k+ parts

-

10k+ parts

$3.116

2,535

$3.180

-

-

$3.116

Semicontronic

India . 6,291 parts In-Stock

1+ parts

$3.240

100+ parts

$3.159

1k+ parts

$3.143

10k+ parts

-

6,291

$3.240

$3.159

$3.143

-

Corphita

USA . 3,154 parts In-Stock

1+ parts

$3.428

100+ parts

-

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3,154

$3.428

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Corohmni

South Africa . 2 parts In-Stock

1+ parts

$3.680

100+ parts

-

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2

$3.680

-

-

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Parana Technologies

USA . 1,533 parts In-Stock

1+ parts

$67.935

100+ parts

-

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1,533

$67.935

-

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ChromeModa Solutions

Germany . 6,711 parts In-Stock

1+ parts

$76.332

100+ parts

$62.592

1k+ parts

-

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6,711

$76.332

$62.592

-

-

IDEA Electronic Components Group

UK . 2,319 parts In-Stock

1+ parts

$76.332

100+ parts

$72.515

1k+ parts

$68.699

10k+ parts

-

2,319

$76.332

$72.515

$68.699

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Lixinc

USA . 14,369 parts In-Stock

1+ parts

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14,369

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Speed Components Ltd (Excess)

Israel . 7,547 parts In-Stock

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7,547

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A-Z Elektronik GmbH

Germany . 7,091 parts In-Stock

1+ parts

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7,091

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 2,097 parts In-Stock

1+ parts

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100+ parts

$68.821

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2,097

-

$68.821

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Infinite Electronics LLP (Excess)

. 992 parts In-Stock

1+ parts

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.116

1k+ parts

$3.021

10k+ parts

$2.957

100

-

$3.116

$3.021

$2.957

Overview

Discover the Texas Instruments CC2650F128RHBR microcontroller, a top-of-the-line device that offers unparalleled quality and reliability. With advanced features like integrated cache, ADC channels, and low power mode, this microcontroller is perfect for a wide range of applications. From industrial automation to IoT devices, this product delivers exceptional performance and efficiency. Trust in Texas Instruments' reputation for excellence and choose the CC2650F128RHBR for all your microcontroller needs. Unlock the potential of your projects with this versatile and powerful solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for protecting the microcontroller, ensuring longevity and reliability.

Integrated Cache: YES

Improves processing speed by storing frequently accessed instructions/data, enhancing overall performance.

Maximum Supply Voltage: 3.8 V

Allows for a wide range of input voltages, making the microcontroller suitable for various applications.

Package Shape: SQUARE

Space-efficient design that simplifies PCB layout and integration into electronic devices.

CPU Family: CORTEX-M3

Part of a widely recognized and established family of processors, offering proven reliability and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined operation.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor (CMOS) technology for low power consumption and high noise immunity.

Connectivity: I2C, I2S, SPI, UART

Supports multiple communication protocols, enabling seamless integration with a variety of peripherals and devices.

Technical Specifications

Microcontrollers CC2650F128RHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CORTEX-M3

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

15

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

20480

RAM Words:

28

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SPI, UART

Peripherals:

DMA(32), RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CC2650F128RHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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