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CC2650F128RGZR

Texas Instruments

CC2650F128RGZR by Texas Instruments

CC2650F128RGZR by Texas Instruments is a microcontroller with Cortex-M3 CPU, 131072 ROM words, and 8 ADC channels. It is ideal for industrial applications requiring low power consumption, featuring I2C, SPI, UART connectivity options and 20480 RAM bytes. With a temperature range of -40 to 85 °C, it offers high performance in a compact chip carrier package.

Median Price

$3.356

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,200 parts In-Stock

1+ parts

$1.698

100+ parts

$1.629

1k+ parts

$1.603

10k+ parts

-

2,200

$1.698

$1.629

$1.603

-

Chip1Stop

Japan . 2,104 parts In-Stock

1+ parts

$2.590

100+ parts

-

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2,104

$2.590

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Texas Instruments

USA . 17,120 parts In-Stock

1+ parts

$4.122

100+ parts

$3.360

1k+ parts

$2.240

10k+ parts

-

17,120

$4.122

$3.360

$2.240

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DigiKey

USA . 2,646 parts In-Stock

1+ parts

$6.660

100+ parts

$5.038

1k+ parts

$4.433

10k+ parts

$4.224

2,646

$6.660

$5.038

$4.433

$4.224

Mouser Electronics

USA . 1,817 parts In-Stock

1+ parts

$7.290

100+ parts

$5.520

1k+ parts

$4.350

10k+ parts

$4.230

1,817

$7.290

$5.520

$4.350

$4.230

Verical

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

$1.587

1k+ parts

$1.548

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2,200

-

$1.587

$1.548

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Distributors (In-Stock)

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Digiode

USA . 3,193 parts In-Stock

1+ parts

$2.206

100+ parts

-

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3,193

$2.206

-

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Ozdisan Elektronik

Türkiye . 2,494 parts In-Stock

1+ parts

$2.951

100+ parts

-

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2,494

$2.951

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Nova Conductors

Japan . 80 parts In-Stock

1+ parts

$3.238

100+ parts

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80

$3.238

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Vyrian

USA . 4,374 parts In-Stock

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4,374

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NAC Semi

USA . 1,994 parts In-Stock

1+ parts

-

100+ parts

$6.520

1k+ parts

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$6.020

1,994

-

$6.520

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$6.020

Prism Electronics

USA . 1 parts In-Stock

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1

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Electronics Depot

USA . 1 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 4,664 parts In-Stock

1+ parts

$1.420

100+ parts

$1.384

1k+ parts

$1.377

10k+ parts

-

4,664

$1.420

$1.384

$1.377

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Corphita

USA . 3,689 parts In-Stock

1+ parts

$2.090

100+ parts

-

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3,689

$2.090

-

-

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Continental Prestige Electronics

USA . 3,634 parts In-Stock

1+ parts

$3.238

100+ parts

-

1k+ parts

-

10k+ parts

$3.173

3,634

$3.238

-

-

$3.173

Argo Parts USA

USA . 1,956 parts In-Stock

1+ parts

$3.238

100+ parts

-

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1,956

$3.238

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Corohmni

South Africa . 81 parts In-Stock

1+ parts

$4.141

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81

$4.141

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Ampacity Inc.

Singapore . 4,369 parts In-Stock

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$4.300

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4,369

$4.300

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Parana Technologies

USA . 1,059 parts In-Stock

1+ parts

$18.940

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$19.006

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1,059

$18.940

-

$19.006

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ChromeModa Solutions

Germany . 6,987 parts In-Stock

1+ parts

$21.281

100+ parts

$17.450

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6,987

$21.281

$17.450

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IDEA Electronic Components Group

UK . 611 parts In-Stock

1+ parts

$21.281

100+ parts

$20.217

1k+ parts

$19.153

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611

$21.281

$20.217

$19.153

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GreenTree Electronics

Israel . 879,671 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,068 parts In-Stock

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Lixinc

USA . 16,221 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Kepictronics

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Perfect Parts

USA . 2,799 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,784 parts In-Stock

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Metaverse IC Inc.

Canada . 2,500 parts In-Stock

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Authorized Procurement Solutions

USA . 2,498 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,856 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,358 parts In-Stock

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1,358

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DigiPath Technology Company

USA . 516 parts In-Stock

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$19.187

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516

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$19.187

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Netroflash

USA . 500 parts In-Stock

1+ parts

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$3.173

1k+ parts

$3.076

10k+ parts

$3.011

500

-

$3.173

$3.076

$3.011

Overview

Unlock the power of cutting-edge technology with the CC2650F128RGZR by Texas Instruments. Designed with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. With features like integrated cache, low power mode, and multiple connectivity options, this product provides exceptional value to customers looking for high-quality solutions. Experience seamless operation and superior functionality with the CC2650F128RGZR, setting new standards in the industry. Elevate your projects with Texas Instruments and push boundaries with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to external factors, ensuring a long-lasting product.

Integrated Cache: YES

Having an integrated cache improves the overall performance and speed of the microcontroller, making it efficient for various applications.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage allows for versatility in power input options, accommodating a wide range of voltage requirements.

On Chip Data RAM Width: 8

The wide data RAM width enables efficient data processing and handling capabilities, enhancing the overall performance of the microcontroller.

No. of Terminals: 48

Having a high number of terminals provides flexibility in connectivity options, allowing for a wide range of peripherals to be connected.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures energy efficiency and compatibility with lower power sources, making it suitable for various power constraints.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture, this product offers optimized performance and energy efficiency for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of applications, making it a reliable choice for various projects.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this microcontroller is suitable for surface mount assembly and reflow soldering processes, ensuring reliability and ease of manufacturing.

Technical Specifications

Microcontrollers CC2650F128RGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CORTEX-M3

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

20480

RAM Words:

28

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SPI, UART

Peripherals:

DMA(32), RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CC2650F128RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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