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CC1201RHB

Texas Instruments

CC1201RHB by Texas Instruments

CC1201RHB by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it is designed for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,812 parts In-Stock

1+ parts

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4,812

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Vyrian

USA . 3,515 parts In-Stock

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3,515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 356 parts In-Stock

1+ parts

$13.860

100+ parts

-

1k+ parts

$14.340

10k+ parts

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356

$13.860

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$14.340

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AZTECH Wire

Italy . 395 parts In-Stock

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$14.245

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395

$14.245

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ChromeModa Solutions

Germany . 2,621 parts In-Stock

1+ parts

$15.573

100+ parts

$12.770

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2,621

$15.573

$12.770

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IDEA Electronic Components Group

UK . 1,680 parts In-Stock

1+ parts

$15.573

100+ parts

$14.794

1k+ parts

$14.016

10k+ parts

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1,680

$15.573

$14.794

$14.016

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One Stop Electronics

USA . 194 parts In-Stock

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$923.000

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194

$923.000

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Corphita

USA . 3,060 parts In-Stock

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3,060

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Northwest PG Solutions

USA . 1,766 parts In-Stock

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1,766

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Native Components

USA . 245 parts In-Stock

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245

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DigiPath Technology Company

USA . 89 parts In-Stock

1+ parts

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100+ parts

$14.041

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89

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$14.041

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Overview

Unleash the power of seamless connectivity with the CC1201RHB by Texas Instruments. Crafted with precision and reliability, this telecom interface IC offers unparalleled performance in a compact package. Whether you're looking to enhance your IoT devices or streamline your communication systems, this product is designed to exceed expectations. With its industrial-grade temperature range and innovative terminal design, the CC1201RHB delivers exceptional value, efficiency, and versatility for all your telecom needs. Elevate your projects with Texas Instruments' trusted quality and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape provides uniform and consistent layout on PCBs, aiding in efficient design and layout of the circuit.

No. of Terminals: 32

With 32 terminals, this product offers a high level of connectivity options, allowing for versatile applications and connectivity possibilities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enables efficient heat dissipation, compact design, and reduced overall size of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in elevated temperature environments, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold environments without compromising performance or reliability.

Terminal Position: QUAD

The quad terminal position enables easy and secure connections on the PCB, ensuring stable and reliable electrical contact.

Maximum Seated Height: 1 mm

The maximum seated height of 1 mm ensures a compact and low-profile design, making this product suitable for applications with space constraints.

Width: 5 mm

The 5 mm width provides a balance between compact size and ease of handling during installation and maintenance.

Length: 5 mm

The 5 mm length contributes to the overall compactness and space-saving design of the product.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliable operation in harsh industrial environments, making this product suitable for rugged applications.

Terminal Form: NO LEAD

The use of lead-free terminal form complies with environmental regulations and safety standards, making this product a sustainable and safe choice.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and compatibility for telecom applications, ensuring reliable communication and connectivity.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides compatibility with standard power sources, making this product easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for high-density mounting on PCBs, maximizing connectivity options and space utilization.

Technical Specifications

Other Function Telecom Interface ICs CC1201RHB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

CC1201RHB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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