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CC1201RHBR

Texas Instruments

CC1201RHBR by Texas Instruments

CC1201RHBR by Texas Instruments is a telecom IC with 32 terminals, operating at 3V. It offers a data rate of 1.25 Mbps and operates in industrial temperature range (-40 to 85°C). This chip carrier package with very thin profile is ideal for telecom circuit applications requiring high-speed data transmission.

Median Price

$4.395

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,762 parts In-Stock

1+ parts

$3.470

100+ parts

$3.041

1k+ parts

$1.718

10k+ parts

-

27,762

$3.470

$3.041

$1.718

-

Mouser Electronics

USA . 3,530 parts In-Stock

1+ parts

$5.320

100+ parts

$3.390

1k+ parts

$3.080

10k+ parts

$3.040

3,530

$5.320

$3.390

$3.080

$3.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.099

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.099

-

-

-

Digiode

USA . 142 parts In-Stock

1+ parts

$3.296

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$3.296

-

-

-

Vyrian

USA . 16,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,510

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 16,746 parts In-Stock

1+ parts

$2.100

100+ parts

-

1k+ parts

-

10k+ parts

-

16,746

$2.100

-

-

-

Corphita

USA . 4,350 parts In-Stock

1+ parts

$3.123

100+ parts

-

1k+ parts

-

10k+ parts

-

4,350

$3.123

-

-

-

Parana Technologies

USA . 235 parts In-Stock

1+ parts

$9.633

100+ parts

-

1k+ parts

$10.226

10k+ parts

-

235

$9.633

-

$10.226

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$10.430

100+ parts

$9.491

1k+ parts

$8.553

10k+ parts

-

200

$10.430

$9.491

$8.553

-

DigiPath Technology Company

USA . 1,235 parts In-Stock

1+ parts

$10.608

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$10.608

-

-

-

ChromeModa Solutions

Germany . 3,430 parts In-Stock

1+ parts

$10.824

100+ parts

$8.876

1k+ parts

-

10k+ parts

-

3,430

$10.824

$8.876

-

-

IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$10.824

100+ parts

$10.283

1k+ parts

$9.742

10k+ parts

-

249

$10.824

$10.283

$9.742

-

Legend Electronics Inc. (Excess)

USA . 159,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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159,320

-

-

-

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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22,000

-

-

-

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Futuretech Components

Singapore . 21,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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21,000

-

-

-

-

Lixinc

USA . 7,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,587

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

iodParts Technologies Inc.

India . 237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

237

-

-

-

-

Overview

Unleash the power of seamless connectivity with the Texas Instruments CC1201RHBR. Crafted with precision and expertise, this telecom interface IC promises unparalleled performance and reliability. Whether you're looking to enhance your IoT devices or revolutionize your communication systems, this product is designed to exceed your expectations. Say goodbye to connectivity issues and hello to a world of endless possibilities with the CC1201RHBR by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and cost-effective PCB assembly.

Package Shape: SQUARE

The square package shape helps in maximizing space efficiency on the board.

Power Supplies (V): 3

With a power supply of 3V, this product is compatible with a wide range of systems.

No. of Terminals: 32

The 32 terminals provide ample connection options for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

The low operating temperature range allows for usage in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The terminal finish of nickel/palladium/gold/silver provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections.

Maximum Seated Height: 1 mm

The low seated height helps in compact design applications.

Width: 5 mm

The 5mm width makes this product suitable for applications with space constraints.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260C ensures reliable soldering during assembly.

Length: 5 mm

The 5mm length is ideal for applications where size is a critical factor.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and improves solder joint reliability.

Telecom IC Type: TELECOM CIRCUIT

The telecom IC type is specifically designed for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V makes this product compatible with standard power sources.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm allows for high-density mounting on PCBs.

Data Rate: 1.25 Mbps

The data rate of 1.25 Mbps enables high-speed data transmission.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this product is suitable for industrial environments with moderate humidity levels.

Technical Specifications

Other Function Telecom Interface ICs CC1201RHBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

1.25 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

CC1201RHBR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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