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BQ27545YZFR-G1

Texas Instruments

BQ27545YZFR-G1 by Texas Instruments

BQ27545YZFR-G1 by Texas Instruments is a Power Management IC with 15 terminals, operating from -40 to 85°C. It supports supply voltages from 2.8V to 4.5V and has a peak reflow temperature of 260°C. Ideal for industrial applications requiring precise power supply support circuits in compact form factors.

Median Price

$4.887

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,475 parts In-Stock

1+ parts

$4.887

100+ parts

$3.984

1k+ parts

$2.656

10k+ parts

-

11,475

$4.887

$3.984

$2.656

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,007 parts In-Stock

1+ parts

$4.643

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-

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2,007

$4.643

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Bristol Electronics

USA . 125 parts In-Stock

1+ parts

$5.617

100+ parts

$2.434

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125

$5.617

$2.434

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Chip Stock

USA . 5,724 parts In-Stock

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5,724

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Vyrian

USA . 4,101 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 125 parts In-Stock

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125

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Dan-Mar Components

USA . 125 parts In-Stock

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125

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Distributors (Availability)

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Native Components

USA . 134 parts In-Stock

1+ parts

$1.300

100+ parts

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134

$1.300

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Northwest PG Solutions

USA . 2,090 parts In-Stock

1+ parts

$1.430

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2,090

$1.430

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Corphita

USA . 4,390 parts In-Stock

1+ parts

$4.398

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4,390

$4.398

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AZTECH Wire

Italy . 236 parts In-Stock

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$12.260

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236

$12.260

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Parana Technologies

USA . 1,124 parts In-Stock

1+ parts

$18.548

100+ parts

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$18.655

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1,124

$18.548

-

$18.655

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DigiPath Technology Company

USA . 792 parts In-Stock

1+ parts

$20.424

100+ parts

$18.790

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792

$20.424

$18.790

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ChromeModa Solutions

Germany . 1,326 parts In-Stock

1+ parts

$20.841

100+ parts

$17.090

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1,326

$20.841

$17.090

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IDEA Electronic Components Group

UK . 563 parts In-Stock

1+ parts

$20.841

100+ parts

$19.799

1k+ parts

$18.757

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563

$20.841

$19.799

$18.757

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Component Stockers USA

USA . 9,191 parts In-Stock

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Lixinc

USA . 8,914 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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A-Z Elektronik GmbH

Germany . 4,701 parts In-Stock

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4,701

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Alle Elektronik GmbH

Germany . 3,134 parts In-Stock

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3,134

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your power management game with the BQ27545YZFR-G1 by Texas Instruments. Designed with precision and quality in mind, this Power Management IC offers unmatched reliability and performance. Perfect for a wide range of applications, this innovative product delivers exceptional value to customers looking for efficient and versatile solutions. Experience the benefits of cutting-edge technology and trust in the advantages that only Texas Instruments can provide. Choose excellence, choose BQ27545YZFR-G1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount design allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal nominal supply voltage ensures stable and efficient performance of the power management IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable operation even in challenging industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures functionality in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin Silver Copper provides good conductivity, corrosion resistance, and solderability for reliable connections.

Technical Specifications

Power Management ICs BQ27545YZFR-G1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B15

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ27545YZFR-G1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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